Abstract: A surface mount device (SMD) soldering assembly having a hot bar that pivots about a point at the center of its base to accommodate non-uniform surfaces, multi-layer circuit board flatness variations and soldering-lead height differences. The hot bar is moved toward the SMD by a main mounting bracket attached to a soldering machine until it contacts the leads to be soldered. When the hot bar contacts an uneven surface, a force is applied to a set of angularly mounted slides which are coupled to ends of a rocking bracket that has the hot bar mounted to its center section. Each angular slide is attached to a support plate at an angle such that it is tangent to an arc defined by the pivot point at the center of the base of the hot bar. As the angular slides move along such arc, the hot bar pivots and thereby adjusts to any unevenness so that optimum thermal contact is made with all the leads to be soldered.

Abstract: A programmable volume dispensing apparatus having a positive displacement metering pump for dispensing varying amounts of high viscosity fluids such as soldering paste. The metering pump comprises a positive displacement metering pump and a digitally driven drive motor under programmable control. The drive motor is connected to the volume adjustment of the pump via a chain and sprocket mechanism. The chain and sprocket mechanism adjusts a stop which controls the stroke of the pump and the volume of fluid dispensed. In an alternate embodiment a flexible rotary drive shaft controls the stroke of the pump and the volume of fluid dispensed. Different volumes of solder can be dispensed to different areas and shapes of pads on a circuit board in accordance with preprogrammed dispensing commands.