Patents by Inventor Marius VALLES GONZALEZ

Marius VALLES GONZALEZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220402206
    Abstract: A 3D printing apparatus is disclosed herein. The 3D printing apparatus comprises a non-powered compartment defining a chamber to contain build material, and a passive latching element connected to a lateral wall of the compartment to be engaged with a complementary latching element of a platform. A drive mechanism of a 3D printing device is engageable with the platform to apply an upward vertical force to the platform to move the platform upwardly. The complementary latching elements are to: passively latch the platform and the compartment together at a latched position such that upward movement of the platform causes upward movement of the compartment until the compartment is restrained at a sealing position; and to passively unlatch the platform from the compartment, upon further upward movement of the platform.
    Type: Application
    Filed: March 24, 2020
    Publication date: December 22, 2022
    Inventors: Albert RODRIGUEZ FERNANDEZ, Marius VALLES GONZALEZ, Gabriel DE LA CAL MENDOZA, Joaquim BRUGUE GARVI, Francesc MELIA SUNE
  • Publication number: 20220371278
    Abstract: A 3D printing apparatus is disclosed herein. The 3D printing apparatus comprises a build compartment defining a build chamber within which a 3D object is to be generated; and a non-powered platform, moveable within the build chamber, comprising a platform drive interface to engage with an external drive mechanism to cause the platform to move. The 3D printing apparatus further comprises a powder compartment located laterally adjacent to the build compartment, within which build material is to be stored for use in the generation of the 3D object. The 3D printing apparatus also comprises a locking interface to couple the 3D printing apparatus with an external hosting device.
    Type: Application
    Filed: January 30, 2020
    Publication date: November 24, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Pau MARTIN VIDAL, Marius VALLES GONZALEZ, Gerard MOSQUERA DONATE, Albert RODRIGUEZ FERNANDEZ, Gabriel DE LA CAL MENDOZA, Francesc MELIA SUNE