Abstract: An electrode stack assembly includes an electrically insulative substrate having a cavity therethrough extending, a first counter electrode on a top surface thereof and extending through the substrate, a second sensing electrode on a bottom surface thereof and extending through the substrate, and a third electrode having a top body portion on a top of the substrate, a bottom body portion on a bottom of the substrate, and a coupling pin passing through the substrate and electrically coupling the top and bottom body portions. The third electrode electrically separates the pin of the sensing electrode from the counter electrode.

Abstract: A sensor is provided for detecting small concentrations of volatile organic compounds in ambient air. The sensor has a lamp assembly and a gas sampling chamber assembly which are operatively associated. The gas sampling chamber assembly has an ionization chamber and an electrode assembly. The electrode assembly has sensing, counter and auxiliary electrodes and circuitry. The electrodes are positioned within the ionization chamber and are separated from one another. The circuitry is configured to apply a voltage difference to the sensing and counter electrodes, control an electrical potential of the auxiliary electrode to be substantially equal to an electrical potential of the counter electrode, measure/estimate a current at the sensing electrode and at the auxiliary electrode, determine a difference between the current at the sensing electrode and the current at the auxiliary electrode, and correct the current at the sensing electrode by using the difference.

Abstract: An electrode stack assembly includes an electrically insulative substrate having a cavity therethrough extending, a first counter electrode on a top surface thereof and extending through the substrate, a second sensing electrode on a bottom surface thereof and extending through the substrate, and a third electrode having a top body portion on a top of the substrate, a bottom body portion on a bottom of the substrate, and a coupling pin passing through the substrate and electrically coupling the top and bottom body portions. The third electrode electrically separates the pin of the sensing electrode from the counter electrode.

Abstract: An electrode stack assembly includes an electrically insulative substrate having a cavity therethrough extending, a first counter electrode on a top surface thereof and extending through the substrate, a second sensing electrode on a bottom surface thereof and extending through the substrate, and a third electrode having a top body portion on a top of the substrate, a bottom body portion on a bottom of the substrate, and a coupling pin passing through the substrate and electrically coupling the top and bottom body portions. The third electrode electrically separates the pin of the sensing electrode from the counter electrode.

Abstract: This disclosure relates to the monitoring and detection of corrosion and/or erosion of pipes, vessels, and other components in an industrial facility. The monitoring system may comprise of an arrangement of guided wave (GW) transducers and a longitudinal wave (LW) transducer affixed to the piping component to collectively measure for localized corrosion of the piping component without necessarily requiring a thickness map. The monitoring system may use an intelligent amplified multiplexer/switch to control the operation of the transducers that may be controlled and operated to generate waves in the kilohertz range and megahertz range with the same hardware.

Abstract: An ultrasonic patch transducer is configured to be secured to an outer surface of a structural asset, such as a pipe or pressure vessel, for condition monitoring. The ultrasonic patch transducer includes a housing defining a centerline between a first end of the housing and a second end of the housing, a piezoelectric element within the housing and positioned along the centerline, and at least two magnets within the housing and positioned along the centerline. The at least two magnets and the piezoelectric element are configured to be positioned along a tangent plane of the structural asset.

Abstract: An ultrasonic measurement system includes abase apparatus, an ultrasonic transducer remote from the base apparatus, a temperature sensing system remote from the base apparatus, and an electrical cable. The base apparatus includes a power supply, a pulse transmitter/receiver; and a base apparatus controller operatively connected to the power supply and the pulse transmitter/receiver. The ultrasonic transducer includes a piezoelectric element. The temperature sensing system includes a temperature measurement instrument operatively connected to a temperature sensor. The electrical cable includes first and second electrical conductors with the first and second conductors electrically connecting the base apparatus, the ultrasonic transducer, and the temperature sensing system. A method of measuring a thickness of an object and a further measurement system are also provided.

Abstract: An electrode stack assembly includes an electrically insulative substrate having a cavity therethrough extending, a first counter electrode on a top surface thereof and extending through the substrate, a second sensing electrode on a bottom surface thereof and extending through the substrate, and a third electrode having a top body portion on a top of the substrate, a bottom body portion on a bottom of the substrate, and a coupling pin passing through the substrate and electrically coupling the top and bottom body portions. The third electrode electrically separates the pin of the sensing electrode from the counter electrode.

Abstract: A system for monitoring a thickness of an asset includes an ultrasonic measurement system and a multiplexer switch module connected by a primary two-conductor connection. The multiplexer switch module includes one or more individual switches that are connected to one or more secondary connections that each terminate in an ultrasonic sensing element. The ultrasonic measurement system includes a controller configured to send a switching command signal to the multiplexer switch module to selectively close an individual switch of the individual switches to connect the primary two-conductor connection with a respective one of the secondary connections. The ultrasonic measurement system is configured to send an electrical pulse through the primary two-conductor connection across the closed individual switch and through the respective secondary connection to cause the associated ultrasonic transducer to generate an ultrasonic wave.

Abstract: An ultrasonic measurement system includes abase apparatus, an ultrasonic transducer remote from the base apparatus, a temperature sensing system remote from the base apparatus, and an electrical cable. The base apparatus includes a power supply, a pulse transmitter/receiver; and a base apparatus controller operatively connected to the power supply and the pulse transmitter/receiver. The ultrasonic transducer includes a piezoelectric element. The temperature sensing system includes a temperature measurement instrument operatively connected to a temperature sensor. The electrical cable includes first and second electrical conductors with the first and second conductors electrically connecting the base apparatus, the ultrasonic transducer, and the temperature sensing system. A method of measuring a thickness of an object and a further measurement system are also provided.

Abstract: A compact variable pitch fan has a drive fluid pitch change mechanism. A pitch change piston is constrained to follow reciprocating motion under drive fluid control within a peripheral hub from which fan blades extend outward. A pitch change sensor is mounted with the rotary union.

Abstract: A compact variable pitch fan has a drive fluid pitch change mechanism. A pitch change piston is constrained to follow reciprocating motion under drive fluid control within a peripheral hub from which fan blades extend outward. A pitch change sensor is mounted with the rotary union.

Abstract: An electronic method for distance measurement based on pulsed laser time-of-flight is provided. The method comprises generating a wave of outgoing radiant energy pulses having a substantially stable period for providing a wave of pulses reflected from a target object and then measuring reflected energy from the pulse wave over a scanning time window. The scanning time window is shorter than the laser pulse time-of-flight to and from the measurement target. An offset between outgoing pulses and the scanning window is adjusted to capture reflected pulses at desired positions within the scanning window for selected conditions including when the outgoing wave is reflected from a reference surface and when the outgoing wave is reflected from the distance target. Distance is then calculated according to the offset and reflected energy data recorded for the selected conditions.

Abstract: An electronic method for distance measurement based on pulsed laser time-of-flight is provided. The method comprises generating a wave of outgoing radiant energy pulses having a substantially stable period for providing a wave of pulses reflected from a target object and then measuring reflected energy from the pulse wave over a scanning time window. The scanning time window is shorter than the laser pulse time-of-flight to and from the measurement target. An offset between outgoing pulses and the scanning window is adjusted to capture reflected pulses at desired positions within the scanning window for selected conditions including when the outgoing wave is reflected from a reference surface and when the outgoing wave is reflected from the distance target. Distance is then calculated according to the offset and reflected energy data recorded for the selected conditions.