Abstract: A micromechanical device having a substrate wafer, a functional layer situated above it which has a mobile micromechanical structure, and a cap situated on top thereof, having a first cavity, which is formed at least by the substrate wafer and the cap and which includes the micromechanical structure. The micromechanical device has a fixed part and a mobile part, which are movably connected to each other with at least one spring element, and the first cavity is situated in the mobile part. Also described is a method for producing the micromechanical device.

Abstract: A micromechanical device having a substrate wafer, a functional layer situated above it which has a mobile micromechanical structure, and a cap situated on top thereof, having a first cavity, which is formed at least by the substrate wafer and the cap and which includes the micromechanical structure. The micromechanical device has a fixed part and a mobile part, which are movably connected to each other with at least one spring element, and the first cavity is situated in the mobile part. Also described is a method for producing the micromechanical device.

Abstract: In one embodiment, a sensor includes a rigid wafer outer body. A first cavity is located within the rigid wafer outer body, and a first vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity. A second vibration isolating spring is supported by the rigid wafer outer body and extends into the first cavity, and a first sensor packaging is supported by the first vibration isolating spring and the second vibration isolating spring within the first cavity.

Abstract: A method for examining signals. The method comprises a step of reading in a signal (204), a step of comparing the signal (204) to an interference signal characteristic characterizing an interference signal in order to determine whether the signal (204) represents the interference signal, and a step of buffering the signal (204) at least for a predetermined time interval in order to obtain a buffered signal (222).

Abstract: A method for examining signals. The method comprises a step of reading in a signal (204), a step of comparing the signal (204) to an interference signal characteristic characterizing an interference signal in order to determine whether the signal (204) represents the interference signal, and a step of buffering the signal (204) at least for a predetermined time interval in order to obtain a buffered signal (222).

Abstract: In one embodiment, a sensor includes a rigid wafer outer body, a first cavity located within the rigid wafer outer body, a first spring supported by the rigid wafer outer body and extending into the first cavity, a second spring supported by the rigid wafer outer body and extending into the first cavity, and a first sensor structure supported by the first spring and the second spring within the first cavity.

Abstract: A combination sensor module for a vehicle, having at least two sensor submodules which are situated in the combination sensor module and able to be connected to the electronics system of the vehicle, wherein the at least two sensor submodules are able to be operated independently of each other.

Abstract: A method for avoiding accidents a biometric sensor system is used to ascertain vital signs of a vehicle occupant, and in the event that the vital signs lie outside a normal range, preparatory emergency measures are carried out in a safety system in the vehicle.

Abstract: A combination sensor module for a vehicle, having at least two sensor submodules which are situated in the combination sensor module and able to be connected to the electronics system of the vehicle, wherein the at least two sensor submodules are able to be operated independently of each other.

Abstract: A substrate material having a mechanical filtering characteristic, the substrate material having at least one support region for supporting the substrate material. In addition, the substrate material includes a sensor region having sensor terminal contacts. Furthermore, the substrate material includes a separating region, which is coupled to the at least one support region and the sensor region and is situated between the at least one support region and the sensor region. In this context, the substrate material in the separating region has a structure different from the substrate material in the support region and/or in the sensor region, in order to form a mechanical filtering characteristic.