Patents by Inventor Mariusz Wozniak

Mariusz Wozniak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11769615
    Abstract: A superconducting joint arrangement for superconducting magnets, having an elongate joint arranged between superconducting filaments of superconducting wires of one or more superconducting coils, and excess wire provided between the elongate joint and the one or more superconducting coils.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: September 26, 2023
    Assignee: Siemens Healthcare Limited
    Inventor: Mariusz Wozniak
  • Publication number: 20210210266
    Abstract: A superconducting joint arrangement for superconducting magnets, having an elongate joint arranged between superconducting filaments of superconducting wires of one or more superconducting coils, and excess wire provided between the elongate joint and the one or more superconducting coils.
    Type: Application
    Filed: April 9, 2019
    Publication date: July 8, 2021
    Applicant: Siemens Healthcare Limited
    Inventor: Mariusz Wozniak
  • Patent number: 9991437
    Abstract: A method for forming superconducting connection structure between at least two superconducting wires is disclosed, where each wire includes at least one superconducting filament. An end piece of each superconducting wire may be positioned inside a cavity of a pressing tool. A contacting material including MgB2 and/or a precursor material for MgB2 may also be positioned inside the cavity. Pressure may be applied to the contacting material through the pressing tool, and the contacting material may be heated inside the cavity. Pressure and heat may be applied simultaneously, at least during part of the process. A superconducting connection structure including at least two superconducting wires, each wire including at least one superconducting filament, and a superconducting connection between the end pieces of the two wires is also disclosed. The connection may be formed of heated and compressed contacting material including MgB2.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: June 5, 2018
    Assignee: SIEMENS PLC
    Inventors: Hannah Brice, Wolfgang Haessler, Marijn Pieter Oomen, Juliane Scheiter, Mariusz Wozniak, Steffen Ziller
  • Publication number: 20170005256
    Abstract: A method for forming superconducting connection structure between at least two superconducting wires is disclosed, where each wire includes at least one superconducting filament. An end piece of each superconducting wire may be positioned inside a cavity of a pressing tool. A contacting material including MgB2 and/or a precursor material for MgB2 may also be positioned inside the cavity. Pressure may be applied to the contacting material through the pressing tool, and the contacting material may be heated inside the cavity. Pressure and heat may be applied simultaneously, at least during part of the process. A superconducting connection structure including at least two superconducting wires, each wire including at least one superconducting filament, and a superconducting connection between the end pieces of the two wires is also disclosed. The connection may be formed of heated and compressed contacting material including MgB2.
    Type: Application
    Filed: November 26, 2014
    Publication date: January 5, 2017
    Applicant: Siemens plc
    Inventors: Hannah Brice, Wolfgang Haessler, Marijn Pieter Oomen, Juliane Scheiter, Mariusz Wozniak, Steffen Ziller