Patents by Inventor MARJORIE K. MYERS

MARJORIE K. MYERS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING A METAL CLAD CIRCUIT BOARD
    Publication number: 20140141548
    Abstract: A metal clad circuit board includes a metal substrate. A dielectric layer is applied to the metal substrate. A conductive seed layer is printed on the dielectric layer. A conductive circuit layer is plated onto the conductive seed layer. Optionally, the conductive seed layer may be inkjet printed on the dielectric layer. Alternatively, the conductive seed layer may be pad printed on the dielectric layer. Optionally, the dielectric layer may be powder coated to the metal substrate. The dielectric layer may include polymers and fillers compression molded to the metal substrate. Optionally, the conductive circuit layer may be electroplated to the conductive seed layer. Optionally, a solder mask may be applied over the conductive circuit layer.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 22, 2014
    Applicant: Tyco Electronics Corporation
    Inventors: Matthew Edward Mostoller, Robert D. Rix, Michael F. Laub, Marjorie K. Myers, Dean Perronne, Miguel Morales, Charles Randall Malstrom, Leonard H. Radzilowski
  • METAL CLAD CIRCUIT BOARD
    Publication number: 20130051018
    Abstract: A metal clad circuit board includes a metal substrate. A dielectric layer is applied to the metal substrate. A conductive seed layer is printed on the dielectric layer. A conductive circuit layer is plated onto the conductive seed layer. Optionally, the conductive seed layer may be inkjet printed on the dielectric layer. Alternatively, the conductive seed layer may be pad printed on the dielectric layer. Optionally, the dielectric layer may be powder coated to the metal substrate. The dielectric layer may include polymers and fillers compression molded to the metal substrate. Optionally, the conductive circuit layer may be electroplated to the conductive seed layer. Optionally, a solder mask may be applied over the conductive circuit layer.
    Type: Application
    Filed: August 23, 2011
    Publication date: February 28, 2013
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: MATTHEW E. MOSTOLLER, ROBERT D. RIX, MICHAEL F. LAUB, MARJORIE K. MYERS, DEAN PERRONNE, MIGUEL MORALES, CHARLES RANDALL MALSTROM, LEONARD H. RADZILOWSKI