Patents by Inventor Marjorie S. Errickson

Marjorie S. Errickson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die attach method and apparatus therefor
    Patent number: 6170736
    Abstract: A semiconductor die bonder (10) has a height adjuster (13) that is positioned next to the die bonding head (11). The height adjuster (13) assist in ensuring that die bonding head (11) positions a semiconductor die (36) at the desired bond line thickness.
    Type: Grant
    Filed: May 4, 1998
    Date of Patent: January 9, 2001
    Assignee: Motorola, Inc.
    Inventors: Martin J. Briehl, Russell J. Elias, Douglas L. Glover, Marjorie S. Errickson