Abstract: Memory module adapters and methods for connecting memory modules to computing systems are disclosed. The memory module adapter includes memory connectors, a multi-memory connector, and a support that supports the memory connectors and multi-memory connector. The memory connectors are electrically connected to the multi-memory connector. Memory modules are connected to a computing system by inserting the memory modules along a first insertion axis into a memory connector of a memory module adapter and inserting the memory module adapter along a second insertion axis to a platform connector of a computing platform within the computing system.

Abstract: Systems and methods for testing components of printed circuit assemblies (PCA) that generate high frequency, low voltage swing signals or that operate using such signals are disclosed. High frequency, low voltage swing signals from the PCA are divided and translated to low frequency signals exhibiting voltage swings compatible with an in-circuit test platform for evaluation. Additionally, high frequency signals exhibiting voltage swings compatible with a PCA are generated. The signals are sent to the PCA for testing components. The division/translation or signal generation/translation logic may be bypassed, enabling the in-circuit test platform and the PCA to send signals between each other even if power to the system is off.