Patents by Inventor Mark A. Douglas

Mark A. Douglas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11689117
    Abstract: In accordance with disclosed embodiments, a power conversion system and method are provided. The power conversion system comprises a main power source configured to deliver drive power to a load and an add-on power module. The add-on power module comprises an isolated DC/DC converter and a low voltage source coupled in series with a high voltage source. The add-on power module is coupled to the main power source and the load and configured to output boost power to the load. The power conversion system further comprises a controller coupled to the main power source and the add-on power module, wherein the controller is configured to: determine that the load requires power from the main power source, and if so, direct boost power from the add-on power module to the load; and direct drive power from the main power source to the load when boost power falls below a predetermined threshold.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: June 27, 2023
    Assignee: Toshiba International Corporation
    Inventors: Da Jiao, Yu Liu, Mark Douglas Rayner
  • Patent number: 11685647
    Abstract: A nanosheet MEMS sensor device and method are described for integrating the fabrication of nanosheet transistors (61) and MEMS sensors (62) in a single nanosheet process flow by forming separate nanosheet transistor and MEMS sensor stacks (12A-16A, 12B-16B) of alternating Si and SiGe layers which are selectively processed to form gate electrodes (49A-C) which replace the silicon germanium layers in the nanosheet transistor stack, to form silicon fixed electrodes using silicon layers (13B-2, 15B-2) on a first side of the MEMS sensor stack, and to form silicon cantilever electrodes using silicon layers (13B-1, 15B-1) on a second side of the MEMS sensor stack by forming a narrow trench opening (54) in the MEMS sensor stack to expose and remove remnant silicon germanium layers on the second side in the MEMS sensor stack.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: June 27, 2023
    Assignee: NXP B.V.
    Inventors: Mark Douglas Hall, Tushar Praful Merchant, Anirban Roy
  • Publication number: 20230184545
    Abstract: Systems and methods for optically measuring a position of a measurement surface relative to a reference position. The system is a wireless network comprising a centrally located data acquisition computer and a multiplicity of remotely located sensor modules mounted at different locations within wireless communication range of a central receiver. Each sensor module is mounted to a clamp that is made specific to a control surface location and embedded with an RFID tag to denote clamp location. The optical components of the sensor modules are selected to enable indication of the linear position of a measurement surface relative to a reference position and then broadcast the measurement results. The broadcast results are received by the central receiver and processed by the data acquisition computer, which hosts human interface software that displays measurement data.
    Type: Application
    Filed: January 28, 2023
    Publication date: June 15, 2023
    Applicant: THE BOEING COMPANY
    Inventors: David M. Konyndyk, Mark Douglas Fuller, Jerry A. James, Timothy P. Huang
  • Publication number: 20230182902
    Abstract: An aircraft interior unit with a detachable panel. The aircraft interior unit comprises a wall comprising a hollow panel, and a door mounted to the wall. The door is slidable between a closed position in which it covers an entrance to the aircraft interior unit, and an open position in which the entrance to the aircraft interior unit is uncovered. In the open position, the door is at least partially disposed within the hollow panel of the wall. The hollow panel can be detached from the rest of the aircraft interior unit, and the door, when moved from the open position, can be detached from the wall.
    Type: Application
    Filed: December 7, 2022
    Publication date: June 15, 2023
    Inventors: Joseph Vuagniaux, Mark Douglas, Daniel Parish
  • Publication number: 20230173504
    Abstract: An apparatus, system and method for hydraulically adjusting and setting a fixed position of an axially displaceable shaft and rotary chipper disc combination, without requiring an attachment to or obstruction of an end face of either end of the axially displaceable shaft. A rotary chipper disc recoil mechanism is also provided for the purpose of detection of unwanted axial and radial forces placed upon the rotating shaft caused by unintentional chipping of metal, and for limiting consequential damage caused by the unintentional chipping of metal and other non-wood materials.
    Type: Application
    Filed: December 7, 2022
    Publication date: June 8, 2023
    Inventors: MARK DOUGLAS ROBINSON, RICHARD BARLOW, JASON M. FLINT, DANIEL R. MCBRIDE, ANDREW R. WILEY
  • Publication number: 20230174656
    Abstract: The application describes a method of treating viral pneumonia in a patient comprising administering an effective amount of a combination of tocilizumab and remdesiver to the patient.
    Type: Application
    Filed: March 19, 2021
    Publication date: June 8, 2023
    Applicant: Genentech, Inc.
    Inventors: Min Bao, Larry Wilse Tsai, Mark Douglas Eisner
  • Publication number: 20230157597
    Abstract: Systems for applying a transcutaneous monitor to a person can include a telescoping assembly, a sensor, and a base with adhesive to couple the sensor to skin. The sensor can be located within the telescoping assembly while the base protrudes from a distal end of the system. The system can be configured to couple the sensor to the base by compressing the telescoping assembly.
    Type: Application
    Filed: January 20, 2023
    Publication date: May 25, 2023
    Inventors: Jason Halac, John Michael Gray, Neal Davis Johnston, Justen Deering England, Peter C. Simpson, Paul V. Neale, Jennifer Blackwell, Maria Noel Brown Wells, Kenneth Pirondini, Andrew Michael Reinhardt, Mark Douglas Kempkey
  • Publication number: 20230130888
    Abstract: A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.
    Type: Application
    Filed: December 23, 2022
    Publication date: April 27, 2023
    Inventors: Mark Douglas Bassett, Bradford KM Stimpson, Alexandre Gourari
  • Patent number: 11616506
    Abstract: A circuit includes a P-channel transistor formed in a P-well and an N-channel transistor formed in an N-well. The first P-channel transistor has a control electrode connected to the P-well. The N-channel transistor is coupled in series with the P-channel transistor and has a control electrode connected to the N-well. Connecting the control electrodes of the P-channel and N-channel transistors to respective P-well and N-well effectively reduces crowbar current in the circuit.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: March 28, 2023
    Assignee: NXP USA, INC.
    Inventors: David Russell Tipple, Mark Douglas Hall
  • Patent number: 11605729
    Abstract: A semiconductor device and fabrication method are described for integrating a nanosheet transistor with a capacitor or nonvolatile memory cell in a single nanosheet process flow by forming a nanosheet transistor stack (11-18) of alternating Si and SiGe layers which are selectively processed to form epitaxial source/drain regions (25A, 25B) and to form gate electrodes (33A-D) which replace the silicon germanium layers in the nanosheet transistor stack, and then selectively forming one or more insulated conductive electrode layers (e.g., 37/39, 25/55, 64/69) adjacent to the nanosheet transistor to define a capacitor or nonvolatile memory cell that is integrated with the nanosheet transistor.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: March 14, 2023
    Assignee: NXP B.V.
    Inventors: Mark Douglas Hall, Tushar Praful Merchant, Anirban Roy
  • Patent number: 11602291
    Abstract: Systems for applying a transcutaneous monitor to a person can include a telescoping assembly, a sensor, and a base with adhesive to couple the sensor to skin. The sensor can be located within the telescoping assembly while the base protrudes from a distal end of the system. The system can be configured to couple the sensor to the base by compressing the telescoping assembly.
    Type: Grant
    Filed: February 3, 2022
    Date of Patent: March 14, 2023
    Assignee: DexCom, Inc.
    Inventors: Jason Halac, John Michael Gray, Neal Davis Johnston, Justen Deering England, Peter C. Simpson, Paul V. Neale, Jennifer Blackwell, Maria Noel Brown Wells, Kenneth Pirondini, Andrew Michael Reinhardt, Mark Douglas Kempkey
  • Patent number: 11589475
    Abstract: A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: February 21, 2023
    Assignee: Redline Communications Inc.
    Inventors: Mark Douglas Bassett, Bradford K M Stimpson, Alexandre Gourari
  • Patent number: 11585653
    Abstract: Systems and methods for optically measuring a position of a measurement surface relative to a reference position. The system is a wireless network comprising a centrally located data acquisition computer and a multiplicity of remotely located sensor modules mounted at different locations within wireless communication range of a central receiver. Each sensor module is mounted to a clamp that is made specific to a control surface location and embedded with an RFID tag to denote clamp location. The optical components of the sensor modules are selected to enable indication of the linear position of a measurement surface relative to a reference position and then broadcast the measurement results. The broadcast results are received by the central receiver and processed by the data acquisition computer, which hosts human interface software that displays measurement data.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: February 21, 2023
    Assignee: The Boeing Company
    Inventors: David M. Konyndyk, Mark Douglas Fuller, Jerry A. James, Timothy P. Huang
  • Patent number: 11584014
    Abstract: An apparatus includes a robot body, at least one sensor coupled to the robot body and positioned to receive stimuli from a passenger cabin of a vehicle, an actuatable component coupled to the robot body, and a computer coupled to the robot body and communicatively coupled to the sensor and the actuatable component. The computer is programmed to predict an imminent anomalous event in the vehicle based on data from the at least one sensor, and in response to the determination, actuate the actuatable component to remediate the anomalous event.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: February 21, 2023
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Sari Kassar, Tony Tae-Jin Pak, Sarra Awad Yako, Mark Douglas Malone
  • Publication number: 20230040693
    Abstract: The present embodiments relate generally to applicators of on-skin sensor assemblies for measuring an analyte in a host, as well as their method of use and manufacture. In some aspects, an applicator for applying an on-skin sensor assembly to a skin of a host is provided. The applicator includes an applicator housing, a needle carrier assembly comprising an insertion element configured to insert a sensor of the on-skin sensor assembly into the skin of the host, a holder releasably coupled to the needle carrier assembly and configured to guide the on-skin sensor assembly while coupled to the needle carrier assembly, and a drive assembly configured to drive the insertion element from a proximal starting position to a distal insertion position, and from the distal insertion position to a proximal retraction position.
    Type: Application
    Filed: October 5, 2022
    Publication date: February 9, 2023
    Inventors: John Michael Gray, Jennifer Blackwell, Paul V. Neale, Justen Deering England, Andrew Joncich, Cameron Brock, Peter C. Simpson, Thomas Metzmaker, Neel Narayan Shah, Mark Douglas Kempkey, Patrick John Castagna, Warren Terry, Jason Halac, Christian Michael Andre George, Daniel E. Apacible, John Charles Barry, Maria Noel Brown Wells, Kenneth Pirondini, Andrew Michael Reinhardt, Jason C. Wong, Remy E. Gagnon, David DeRenzy, Randall Scott Koplin, Alan Baldwin, Young Woo Lee, David A. Keller, Louise Emma van den Heuvel, Carol Wood Sutherland
  • Publication number: 20230023008
    Abstract: The present embodiments relate generally to applicators of on-skin sensor assemblies for measuring an analyte in a host, as well as their method of use and manufacture. In some aspects, an applicator for applying an on-skin sensor assembly to a skin of a host is provided. The applicator includes an applicator housing, a needle carrier assembly comprising an insertion element configured to insert a sensor of the on-skin sensor assembly into the skin of the host, a holder releasably coupled to the needle carrier assembly and configured to guide the on-skin sensor assembly while coupled to the needle carrier assembly, and a drive assembly configured to drive the insertion element from a proximal starting position to a distal insertion position, and from the distal insertion position to a proximal retraction position.
    Type: Application
    Filed: October 5, 2022
    Publication date: January 26, 2023
    Inventors: John Michael Gray, Jennifer Blackwell, Paul V. Neale, Justen Deering England, Andrew Joncich, Cameron Brock, Peter C. Simpson, Thomas Metzmaker, Neel Narayan Shah, Mark Douglas Kempkey, Patrick John Castagna, Warren Terry, Jason Halac, Christian Michael Andre George, Daniel E. Apacible, John Charles Barry, Maria Noel Brown Wells, Kenneth Pirondini, Andrew Michael Reinhardt, Jason C. Wong, Remy E. Gagnon, David DeRenzy, Randall Scott Koplin, Alan Baldwin, Young Woo Lee, David A. Keller, Louise Emma van den Heuvel, Carol Wood Sutherland
  • Publication number: 20230022706
    Abstract: Systems and methods for using a non-stick conductive material to automate tool touch-off in an additive manufacturing process are provided. A substrate comprises a first conductive layer, an intermediate binder layer, and a second non-stick conductive layer. The non-stick conductive layer may comprise perfluoroalkoxy alkanes and carbon nanotubes. An electrical connection may be made between the first conductive layer and the second non-stick conductive layer. When used with an additive manufacturing device, when the nozzle of the device contacts the substrate, a circuit may close resulting in a detectable voltage drop. When the voltage drop is detected, a reference point for the additive manufacturing device may be set.
    Type: Application
    Filed: July 21, 2021
    Publication date: January 26, 2023
    Inventors: Steven Todd LaPlant, Matthew Wayne Trimmer, Nicholas Christopher Ogden, Mark Douglas Smith, Ruben Arturo Pino
  • Publication number: 20230022850
    Abstract: A modular die cast enclosure comprising a top section with a top mid-plane and a bottom section with a bottom mid-plane and an internal bottom cover. The bottom section having one or more of a first type of connectors. The top section having one or more of a second type of connectors on. The internal bottom cover having one or more of a third type of connectors. Wherein said first type of connectors couple with said second type of connectors when the top section is placed on the bottom section and allow to electrically connect said top and bottom sections via said third type of connectors.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 26, 2023
    Inventors: Mark Douglas BASSETT, Bradford KM STIMPSON, Alexandre GOURARI
  • Publication number: 20230014091
    Abstract: Applicators for applying an on-skin assembly to skin of a host and methods of their use and/or manufacture are provided. An applicator includes an insertion assembly configured to insert at least a portion of the on-skin assembly into the skin of the host, a housing configured to house the insertion assembly, the housing comprising an aperture through which the on-skin assembly can pass, an actuation member configured to, upon activation, cause the insertion assembly to insert at least the portion of the on-skin assembly into the skin of the host, and a sealing element configured to provide a sterile barrier and a vapor barrier between an internal environment of the housing and an external environment of the housing.
    Type: Application
    Filed: September 15, 2022
    Publication date: January 19, 2023
    Inventors: Joseph J. Baker, Philip Thomas Pupa, Timothy Joseph Goldsmith, Jonathan Bodnar, Jason Halac, John Michael Gray, Neal Davis Johnston, Justen Deering England, Peter C. Simpson, Paul V. Neale, Jennifer Blackwell, Maria Noel Brown Wells, Kenneth Pirondini, Andrew Michael Reinhardt, Mark Douglas Kempkey, Young Woo Lee, Warren Terry, Patrick John Castagna, David A. Keller, Randall Scott Koplin, Andrew Joncich, Nirav Bhatt
  • Publication number: 20230000403
    Abstract: Applicators for applying an on-skin assembly to skin of a host and methods of their use and/or manufacture are provided. An applicator includes an insertion assembly configured to insert at least a portion of the on-skin assembly into the skin of the host, a housing configured to house the insertion assembly, the housing comprising an aperture through which the on-skin assembly can pass, an actuation member configured to, upon activation, cause the insertion assembly to insert at least the portion of the on-skin assembly into the skin of the host, and a sealing element configured to provide a sterile barrier and a vapor barrier between an internal environment of the housing and an external environment of the housing.
    Type: Application
    Filed: September 7, 2022
    Publication date: January 5, 2023
    Inventors: Joseph J. Baker, Philip Thomas Pupa, Timothy Joseph Goldsmith, Jonathan Bodnar, Jason Halac, John Michael Gray, Neal Davis Johnston, Justen Deering England, Peter C. Simpson, Paul V. Neale, Jennifer Blackwell, Maria Noel Brown Wells, Kenneth Pirondini, Andrew Michael Reinhardt, Mark Douglas Kempkey, Young Woo Lee, Warren Terry, Patrick John Castagna, David A. Keller, Randall Scott Koplin, Andrew Joncich, Nirav Bhatt