Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Abstract: An apparatus for automatically routing a wire lead of a stator from a first position to a second position includes a base assembly to receive the stator. A clamp assembly is mounted on the base assembly to hold the wire lead in the first position. An arbor rotates the wire lead. The arbor has a holder to hold the wire lead. An end effector grips and moves the wire lead. A controller moves the end effector to grip the wire lead at the first position and to couple the wire lead with the arbor. Further, the controller rotates the arbor to rotate the wire lead along the circumference of the stator by a pre-determined angle. The controller moves the end effector to grip the wire lead held by the holder, and to move the wire lead to the second position.

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Abstract: An apparatus for automatically routing a wire lead of a stator from a first position to a second position includes a base assembly to receive the stator. A clamp assembly is mounted on the base assembly to hold the wire lead in the first position. An arbor rotates the wire lead. The arbor has a holder to hold the wire lead. An end effector grips and moves the wire lead. A controller moves the end effector to grip the wire lead at the first position and to couple the wire lead with the arbor. Further, the controller rotates the arbor to rotate the wire lead along the circumference of the stator by a pre-determined angle. The controller moves the end effector to grip the wire lead held by the holder, and to move the wire lead to the second position.

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Abstract: A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Abstract: An improved method of warm folding polymeric sheet material and apparatus for accomplishing the method. The method involves applying conductive heat to both sides of the material prior to folding and is accomplished in steps including: (a) positioning the sheet material; (b) positioning a mandrel plate so as to define a fold line for the sheet material; (c) positioning an exterior heater against the material along the fold line; (d) positioning an interior heater element against the material opposite the exterior heater; (e) and (f) applying preselected amounts of heat to the fold line area through the heaters; (g) retracting the interior heater; (h) mechanically folding the sheet material along a fold line; and (i) annealing the fold by applying additional heat through the exterior heater. The process may also be augmented by adding additional steps.The primary use of the invention is in folding polyvinyl chloride jackets for use in enclosing floppy disks.

Abstract: Presented is a method and apparatus for the substantial automatic folding of flat pre-cut blanks of sheet material to form storage envelopes for floppy or rigid disc storage devices. The machine includes a pedestal formed in part by an electromagnet associated with a clamp plate that constitutes an Armature to retain the sheet material immovable during the folding operation. Additionally, there are provided three rams each associated with a pivotal shoe for folding selected portions of the flat sheet, and reciprocable glue dispensing means are provided for dispensing glue at the appropriate time, in an appropriate amount, and in an appropriate location. The mechanical aspects of the apparatus are connected to and controlled by a computer that scans the functions of the machine to determine if the machine is operating properly and signals the operator through an alphanumeric display panel if there is a malfunction in the apparatus.