Patents by Inventor Mark A. French

Mark A. French has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240073180
    Abstract: Systems and methods for the dynamic selection of IP address in email platforms, and the synchronization of hostnames and IP addresses in such platforms, are disclosed.
    Type: Application
    Filed: September 27, 2023
    Publication date: February 29, 2024
    Inventors: Bryan Adam Joyner, Patrick Stephen Trantham, Mark Albert Mackenzie, John French Kalan, William Scott Henderson
  • Patent number: 11358323
    Abstract: A system includes a plurality of assemblies each configured to support a dental mold and a material, a heating system configured to heat the material, a forming system configured to form a chamber encompassing the dental mold and at least a portion of the heated material, and to cause the heated material to form over the dental mold, and a conveyor system configured to move the plurality of assemblies from a loading area to the heating system, from the heating system to the forming system, and from the forming system to an unloading area.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: June 14, 2022
    Assignee: SDC U.S. SMILEPAY SPV
    Inventors: Clete Culp, Christopher Yancey, John Dargis, Mark French, Daniel Pfeffer, Steve Cicurel
  • Publication number: 20200316841
    Abstract: A system includes a plurality of assemblies each configured to support a dental mold and a material, a heating system configured to heat the material, a forming system configured to form a chamber encompassing the dental mold and at least a portion of the heated material, and to cause the heated material to form over the dental mold, and a conveyor system configured to move the plurality of assemblies from a loading area to the heating system, from the heating system to the forming system, and from the forming system to an unloading area.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Inventors: Clete Culp, Christopher Yancey, John Dargis, Mark French, Daniel Pfeffer, Steve Cicurel
  • Patent number: 10688710
    Abstract: A system includes a plurality of assemblies each configured to support a dental mold and a material, a heating system configured to heat the material, a forming system configured to form a chamber encompassing the dental mold and at least a portion of the heated material, and to cause the heated material to form over the dental mold, and a conveyor system configured to move the plurality of assemblies from a loading area to the heating system, from the heating system to the forming system, and from the forming system to an unloading area.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: June 23, 2020
    Assignee: SmileDirectClub LLC
    Inventors: Clete Culp, Christopher Yancey, John Dargis, Mark French, Daniel Pfeffer, Steve Cicurel
  • Publication number: 20200147856
    Abstract: A system includes a plurality of assemblies each configured to support a dental mold and a material, a heating system configured to heat the material, a forming system configured to form a chamber encompassing the dental mold and at least a portion of the heated material, and to cause the heated material to form over the dental mold, and a conveyor system configured to move the plurality of assemblies from a loading area to the heating system, from the heating system to the forming system, and from the forming system to an unloading area.
    Type: Application
    Filed: May 29, 2019
    Publication date: May 14, 2020
    Applicant: SmileDirectClub LLC
    Inventors: Clete Culp, Christopher Yancey, John Dargis, Mark French, Daniel Pfeffer, Steve Cicurel
  • Patent number: 10315353
    Abstract: A system includes a heating system, a forming system, a conveyor system, and a plurality of thermoforming assemblies for supporting a dental mold and a thermoforming material. The heating system includes a first heater to heat the thermoforming material when proximate the first heater, a second heater configured to heat the thermoforming material when proximate the second heater, and a temperature sensor to detect a temperature of the thermoforming material when the thermoforming material is proximate either of the first heater and the second heater. The forming system includes an actuator and a pressure system to compress the heated thermoforming material to the dental mold. The conveyor system moves the plurality of thermoforming assemblies in a stepwise movement sequence from a loading area to the heating system, from the heating system to the forming system, and from the forming system to an unloading area.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: June 11, 2019
    Assignee: SmileDirectClub LLC
    Inventors: Clete Culp, Christopher Yancey, John Dargis, Mark French, Daniel Pfeffer, Steve Cicurel
  • Publication number: 20170065030
    Abstract: A wiping device may be a friable layer or an absorbent pad made of a material that can absorb and retain a fluid composition and can be attached or is attached to an item of clothing, such as a sock, shoe, compression sleeve, etc. The device is impregnated with an adhesive-type tacky substance that is released when a shoe sole is wiped against it to clean the shoe sole and allow surface dust and debris to be removed from the shoe sole. The deposited substance also forms a film or coating that remains adhered to the surface of the shoe sole to improve traction by imparting tackiness to the shoe sole.
    Type: Application
    Filed: September 16, 2016
    Publication date: March 9, 2017
    Inventors: Mark French, Lucas James Tucker, Timothy Edward Banach
  • Patent number: 9578923
    Abstract: An athletic shoe coating for traction enhancement includes a pressure sensitive adhesive (PSA) and a tackyfying resin and a film former initially in solution within a solvent suitable for application to the surface of a shoe sole in liquid form, such as by spraying, rolling and brushing the solution onto the shoe sole. After the solvent evaporates a film or coating attaches or is bonded to the shoe sole that exhibits the property of dynamically modifying the traction properties of the shoe sole when pressure and shear forces are applied to the coating. Such modification causes the exterior surface of the film or coating to “refresh” the exposed surface upon impact. This imparts continued tackiness over extended use. Impact modifiers may be added for controlled release of a solvent to temporarily dissolve or soften the film or coating to promote such refreshment of the coating outer surface.
    Type: Grant
    Filed: June 16, 2011
    Date of Patent: February 28, 2017
    Assignee: Mission Product Holdings, Inc.
    Inventors: Mark French, Lucas James Tucker, Timothy Edward Banach
  • Patent number: 9385242
    Abstract: TSV devices with p-n junctions that are planar have superior performance in breakdown and current handling. Junction diode assembly formed in enclosed trenches occupies less chip area compared with junction-isolation diode assembly in the known art. Diode assembly fabricated with trenches formed after the junction formation reduces fabrication cost and masking steps increase process flexibility and enable asymmetrical TSV and uni-directional TSV functions.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: July 5, 2016
    Assignee: Diodes Incorporated
    Inventors: John Earnshaw, Wolfgang Kemper, Yen-Li Lin, Steve Badcock, Mark French
  • Patent number: 9275620
    Abstract: A retrofit pickup assembly for stringed instruments is disclosed. The retrofit pickup assembly includes an existing coil and existing or new magnets and a flexible circuit having a plurality of wires and two connectors. A pickup assembly for new stringed instruments is also disclosed utilizing the same principles. A method of retrofitting an existing pickup assembly for stringed instruments is also disclosed.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: March 1, 2016
    Assignee: PURDUE RESEARCH FOUNDATION
    Inventors: Davin Howard Huston, Richard Mark French, Kathryn Lee Lupacchino
  • Publication number: 20150326480
    Abstract: A method for providing a conditional action following TCAM lookup is disclosed. The method for providing a conditional action following TCAM lookup includes obtaining data; generating a lookup key from the data; performing a TCAM lookup using the key; and in the event the TCAM lookup generates a match, then performing an test to determine if there is exists a condition associated with the action associated with that match, and in the event the there is a condition, evaluating said condition associated with the action of that match entry; and in the event that said condition is satisfied, then performing a conditional action. The data may be from a communications packet header, the condition evaluation may be one of packet length or Time to Live (TTL) value, and the action taken may be one of dropping or forwarding a communications packet. The method for providing a conditional action following TCAM lookup is particularly useful for reducing the quantity of entries in a TCAM of TCAM filters known in the art.
    Type: Application
    Filed: May 7, 2014
    Publication date: November 12, 2015
    Inventors: Andrew Dolganow, Mark French
  • Publication number: 20150206985
    Abstract: TSV devices with p-n junctions that are planar have superior performance in breakdown and current handling. Junction diode assembly formed in enclosed trenches occupies less chip area compared with junction-isolation diode assembly in the known art. Diode assembly fabricated with trenches formed after the junction formation reduces fabrication cost and masking steps increase process flexibility and enable asymmetrical TSV and uni-directional TSV functions.
    Type: Application
    Filed: March 30, 2015
    Publication date: July 23, 2015
    Applicant: DIODES INCORPORATED
    Inventors: John Earnshaw, Wolfgang Kemper, Yen-Yi Lin, Steve Badcock, Mark French
  • Patent number: 9048106
    Abstract: TSV devices with p-n junctions that are planar have superior performance in breakdown and current handling. Junction diode assembly formed in enclosed trenches occupies less chip area compared with junction-isolation diode assembly in the known art. Diode assembly fabricated with trenches formed after the junction formation reduces fabrication cost and masking steps increase process flexibility and enable asymmetrical TSV and uni-directional TSV functions.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: June 2, 2015
    Assignee: Diodes Incorporated
    Inventors: John Earnshaw, Wofgang Kemper, Yen-Yi Lin, Steve Badcock, Mark French
  • Publication number: 20150068392
    Abstract: A retrofit pickup assembly for stringed instruments is disclosed. The retrofit pickup assembly includes an existing coil and existing or new magnets and a flexible circuit having a plurality of wires and two connectors. A pickup assembly for new stringed instruments is also disclosed utilizing the same principles. A method of retrofitting an existing pickup assembly for stringed instruments is also disclosed.
    Type: Application
    Filed: September 9, 2014
    Publication date: March 12, 2015
    Applicant: PURDUE RESEARCH FOUNDATION
    Inventors: Davin Howard Huston, Richard Mark French, Kathryn Lee Lupacchino
  • Patent number: 8848587
    Abstract: Multicasting network packets is disclosed. A total number of copies of a frame, t, to be sent is determined. A number of copies of the frame, m, which is less than a total number of copies of the frame, t, to be made during a current iteration is determined. M copies of the frame are made. The m copies of the frame are then sent to their destinations. The original input frame is provided as output with an indication that the frame should be returned for further processing. Processing of the frame is discontinued during an interval in which other frames are processed. The process is repeated until t copies have been sent.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: September 30, 2014
    Assignee: Alcatel Lucent
    Inventors: Mark A. L. Smallwood, Michael J. Clarke, Mark A. French, Martin R. Lea
  • Patent number: 8800174
    Abstract: Shoe soles with and without removable/replaceable gripping pods for athletic or sport shoes are provided with enhanced traction. The sole portions or gripping pods may be provided with a supply of a substance that exhibits a tackiness for enhancing friction between the shoe sole and the any hard floor. The tackiness-enhancing substance may be time-released or discharged from within the shoe sole onto the lower surface(s) of the sole that make(s) contact with the smooth hard playing surface or may be in response to compression or shear forces acting on the sole during play to prolong the tacky properties and reduce slippage. A visual indicator may be provided for notifying the player that it is time to replace the worn or used pod and insert a fresh pod or insert into the pod(s) to maintain high levels of gripping.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: August 12, 2014
    Assignee: Mission Product Holdings, Inc.
    Inventors: Timothy Edward Banach, Lucas James Tucker, Mark French
  • Publication number: 20140167204
    Abstract: TSV devices with p-n junctions that are planar have superior performance in breakdown and current handling. Junction diode assembly formed in enclosed trenches occupies less chip area compared with junction-isolation diode assembly in the known art. Diode assembly fabricated with trenches formed after the junction formation reduces fabrication cost and masking steps increase process flexibility and enable asymmetrical TSV and uni-directional TSV functions.
    Type: Application
    Filed: December 13, 2012
    Publication date: June 19, 2014
    Applicant: DIODES INCORPORATED
    Inventors: John Earnshaw, Wofgang Kemper, Yen-Yi Lin, Steve Badcock, Mark French
  • Patent number: 8730249
    Abstract: A parallel array architecture for a graphics processor includes a multithreaded core array including a plurality of processing clusters, each processing cluster including at least one processing core operable to execute a pixel shader program that generates pixel data from coverage data; a rasterizer configured to generate coverage data for each of a plurality of pixels; and pixel distribution logic configured to deliver the coverage data from the rasterizer to one of the processing clusters in the multithreaded core array. A crossbar coupled to each of the processing clusters is configured to deliver pixel data from the processing clusters to a frame buffer having a plurality of partitions.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: May 20, 2014
    Assignee: NVIDIA Corporation
    Inventors: John M. Danskin, John S. Montrym, John Erik Lindholm, Steven E. Molnar, Mark French
  • Publication number: 20120066938
    Abstract: Shoe soles with and without removable/replaceable gripping pods for athletic or sport shoes are provided with enhanced traction. The sole portions or gripping pods may be provided with a supply of a substance that exhibits a tackiness for enhancing friction between the shoe sole and the any hard floor. The tackiness-enhancing substance may be time-released or discharged from within the shoe sole onto the lower surface(s) of the sole that make(s) contact with the smooth hard playing surface or may be in response to compression or shear forces acting on the sole during play to prolong the tacky properties and reduce slippage. A visual indicator may be provided for notifying the player that it is time to replace the worn or used pod and insert a fresh pod or insert into the pod(s) to maintain high levels of gripping.
    Type: Application
    Filed: July 8, 2011
    Publication date: March 22, 2012
    Inventors: MARK FRENCH, LUCAS JAMES TUCKER, TIMOTHY EDWARD BANACH
  • Publication number: 20120026171
    Abstract: A parallel array architecture for a graphics processor includes a multithreaded core array including a plurality of processing clusters, each processing cluster including at least one processing core operable to execute a pixel shader program that generates pixel data from coverage data; a rasterizer configured to generate coverage data for each of a plurality of pixels; and pixel distribution logic configured to deliver the coverage data from the rasterizer to one of the processing clusters in the multithreaded core array. A crossbar coupled to each of the processing clusters is configured to deliver pixel data from the processing clusters to a frame buffer having a plurality of partitions.
    Type: Application
    Filed: October 7, 2011
    Publication date: February 2, 2012
    Applicant: NVIDIA Corporation
    Inventors: John M. Danskin, John S. Montrym, John Erik Lindholm, Steven E. Molnar, Mark French