Abstract: A system for using a reference plane to control transmission line characteristic impedance includes a signal trace located in a multi-layer structure and at least one constant thickness reference plane proximate to the signal trace, the constant thickness reference plane located with respect to the signal trace so as to provide a desired characteristic impedance between the signal trace and the constant thickness reference plane.

Abstract: A ball grid array (BGA) and via pattern includes a printed circuit board (PCB) having a surface on which a plurality of regions are formed and a transmit (TX) and receive (RX) cluster comprising a transmit differential signal pair and a receive differential signal pair formed using at least a portion of the plurality of regions on the surface of the PCB, the transmit differential signal pair and the receive differential signal pair comprising nodes arranged in a diagonal orientation in which each node of the receive differential signal pair is equidistant from each node of the transmit differential signal pair.

Abstract: A system for using a reference plane to control transmission line characteristic impedance includes a signal trace located in a multi-layer structure and at least one constant thickness reference plane proximate to the signal trace, the constant thickness reference plane located with respect to the signal trace so as to provide a desired characteristic impedance between the signal trace and the constant thickness reference plane.

Abstract: A ball grid array (BGA) and via pattern includes a printed circuit board (PCB) having a surface on which a plurality of regions are formed and a transmit (TX) and receive (RX) cluster comprising a transmit differential signal pair and a receive differential signal pair formed using at least a portion of the plurality of regions on the surface of the PCB, the transmit differential signal pair and the receive differential signal pair comprising nodes arranged in a diagonal orientation in which each node of the receive differential signal pair is equidistant from each node of the transmit differential signal pair.

Abstract: A weld controller utilizing a constant current control employs a stepper program for increasing current boost in predetermined percentage increments or steps following a predetermined stepper current profile to provide compensation for contact tip wear. The weld controller acquires weld power data in the form of current and voltage samples for each step of the stepper program, and computes Volt Amperes or power from this data during an acquisition run through the stepper program. The stepper program specifies a constant current at each step. Associated with each incremental current step, weld power that is required to produce that weld current is determined by the weld controller to generate a characteristic power curve. The power curve will be over the range of currents as specified by the combination of the programmed weld current and the range of current boost as specified by the stepper schedule. The weld controller will build a table of values relating weld current and delivered power or Volt Amperes.

Abstract: A weld controller employs a stepper program for increasing heat boost in one percent increments or steps to provide compensation for contact tip wear. The weld controller acquires weld current data in the form of current samples for each step to create a characteristic curve or nominal current profile for the stepper program. Subsequent operations of the weld control utilize high and low current limit thresholds that track the nominal current profile. The thresholds can be defined as a fixed offset from the profile or as a percentage of the profile at each step of the stepper program. This allows the use of current limits to be established in close proximity to the nominal weld current at all times, enabling the use of tighter tolerances.