Abstract: The present invention provides a method, structure, and system of beveling staggered card edges. In some embodiments, the method, computer program product, and system include receiving a card with a plug end and two or more metal contact leads running up to the plug end, removing material from the plug end such that one or more engagement points for one or more of the leads are set back from the plug end resulting in staggered steps, where an engagement point is where a metal contact lead will enter a receptacle, and removing material from an edge formed for each engagement point of the card such that beveled edges are created at the one or more engagement points for each lead.

Abstract: The present invention provides a method, structure, and system of beveling staggered card edges. In some embodiments, the method, computer program product, and system include receiving a card with a plug end and two or more metal contact leads running up to the plug end, removing material from the plug end such that one or more engagement points for one or more of the leads are set back from the plug end resulting in staggered steps, where an engagement point is where a metal contact lead will enter a receptacle, and removing material from an edge formed for each engagement point of the card such that beveled edges are created at the one or more engagement points for each lead.

Abstract: An apparatus includes an analog front end to receive an analog input including user data, and an analog-to-digital converter to convert the analog input to digital signals including the user data. A digital channelizer may process the digital signals to generate frequency slices of user data, and a digital combiner may assemble the frequency slices to form output sub-bands of user data. A digital switch may route the frequency slices from the digital channelizer to the digital combiner according to a selected map of a plurality of available maps. The apparatus also includes a map selector to communicate map select data that indicates the selected map. The digital channelizer may receive and insert the map select data into the frequency slices in-band with the user data thereof. And the digital switch may interpret the map select data inserted into and route the frequency slices according to the selected map.

Abstract: An apparatus includes an analog front end to receive an analog input including user data, and an analog-to-digital converter to convert the analog input to digital signals including the user data. A digital channelizer may process the digital signals to generate frequency slices of user data, and a digital combiner may assemble the frequency slices to form output sub-bands of user data. A digital switch may route the frequency slices from the digital channelizer to the digital combiner according to a selected map of a plurality of available maps. The apparatus also includes a map selector to communicate map select data that indicates the selected map. The digital channelizer may receive and insert the map select data into the frequency slices in-band with the user data thereof. And the digital switch may interpret the map select data inserted into and route the frequency slices according to the selected map.

Abstract: An apparatus includes an analog front end to receive an analog input including user data, and an analog-to-digital converter to convert the analog input to digital signals including the user data. A digital channelizer may process the digital signals to generate frequency slices of user data, and a digital combiner may assemble the frequency slices to form output sub-bands of user data. A digital switch may route the frequency slices from the digital channelizer to the digital combiner according to a selected map of a plurality of available maps. The apparatus also includes a map selector to communicate map select data that indicates the selected map. The digital channelizer may receive and insert the map select data into the frequency slices in-band with the user data thereof. And the digital switch may interpret the map select data inserted into and route the frequency slices according to the selected map.

Abstract: An apparatus includes an analog front end to receive an analog input including user data, and an analog-to-digital converter to convert the analog input to digital signals including the user data. A digital channelizer may process the digital signals to generate frequency slices of user data, and a digital combiner may assemble the frequency slices to form output sub-bands of user data. A digital switch may route the frequency slices from the digital channelizer to the digital combiner according to a selected map of a plurality of available maps. The apparatus also includes a map selector to communicate map select data that indicates the selected map. The digital channelizer may receive and insert the map select data into the frequency slices in-band with the user data thereof. And the digital switch may interpret the map select data inserted into and route the frequency slices according to the selected map.

Abstract: A system and method are provided for processing transactions between at least one buying company and at least one selling company using a central datastore accessible to users from the buying company and selling company. Purchase order and invoice data are obtained and compared to identify a matched record having purchase order data and corresponding invoice data. A collaborative data set in the central datastore is created, based in part on the matched record and storing in the datastore detailed settlement data regarding settlement of the matched record of purchase order data and corresponding invoice data. A complete settlement transaction history is stored by providing for storage of additional settlement data in the central datastore, wherein credit memos, debit memos regarding the invoice, the purchase order of the matched record, and/or other documents related to the transaction are stored as part of the collaborative data set.

Abstract: A system and method are provided for processing transactions between at least one buying company and at least one selling company using a central datastore accessible to users from the buying company and selling company. Purchase order and invoice data are obtained and compared to identify a matched record having purchase order data and corresponding invoice data. A collaborative data set in the central datastore is created, based in part on the matched record and storing in the datastore detailed settlement data regarding settlement of the matched record of purchase order data and corresponding invoice data. A complete settlement transaction history is stored by providing for storage of additional settlement data in the central datastore, wherein credit memos, debit memos regarding the invoice, the purchase order of the matched record, and/or other documents related to the transaction are stored as part of the collaborative data set.

Abstract: A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.

Abstract: A via resistor structure and method are provided for implementing a resistor and for trimming a resistance value of the resistor. A resistive material selectively is deposited adjacent to a pad connecting to a via where a resistor is to be defined. A trimmed path is formed in the resistive material for selectively changing the resistance value of the resistor.

Abstract: A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric material having a predefined dielectric property. The dielectric material is selected to alter at least one predefined electrical property of the selected signal traces, such as, coupling, propagation delay and attenuation. In one embodiment, an outer layer of a printed circuit card includes a plurality of signal traces and a mating circuit card layer including a plurality of matching signal traces is attached to the outer layer of the printed circuit card to create a cavity near selected signal traces. The cavity is filled with the selected dielectric material. In another embodiment, dielectric material is selectively removed near signal traces on an outer layer of the printed circuit card to define a void near selected signal traces.

Abstract: A method and structures are provided for implementing customizable dielectric printed circuit card traces. A void is defined near selected signal traces. The void is then filled with a dielectric material having a predefined dielectric property. The dielectric material is selected to alter at least one predefined electrical property of the selected signal traces, such as, coupling, propagation delay and attenuation. In one embodiment, an outer layer of a printed circuit card includes a plurality of signal traces and a mating circuit card layer including a plurality of matching signal traces is attached to the outer layer of the printed circuit card to create a cavity near selected signal traces. The cavity is filled with the selected dielectric material. In another embodiment, dielectric material is selectively removed near signal traces on an outer layer of the printed circuit card to define a void near selected signal traces.

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract: A system and method is provided for processing transactions between at least one buying company and at least one selling company which results in the creation of a new collaborative data set. In one embodiment, the method comprises providing a central datastore accessible to users from the buying company and users from the selling company. Purchase order and invoice data are obtained and compared via a computer, to identify a matched record having purchase order data and corresponding invoice data. A collaborative data set in the central datastore is created, based in part on the matched record and storing in the datastore detailed settlement data regarding settlement of the matched record of purchase order data and corresponding invoice data.