Patents by Inventor Mark A. Licon

Mark A. Licon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9200186
    Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: December 1, 2015
    Assignee: Avery Dennison Corporation
    Inventors: Kourosh Kian, Souphong Lee, Dong-Tsai Hseih, Mark A. Licon, David N. Edwards, Johannes Lenkl, Rishikesh K. Bharadwaj, Prakash Mallya, Kai Li
  • Patent number: 9159018
    Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: October 13, 2015
    Assignee: Avery Dennison Corporation
    Inventors: James P. Coleman, David N. Edwards, Ian J. Forster, Pradeep Iyer, Mark A. Licon
  • Patent number: 8927100
    Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.
    Type: Grant
    Filed: May 13, 2013
    Date of Patent: January 6, 2015
    Assignee: Avery Dennison Corporation
    Inventors: Kourosh Kian, Souphong Lee, Dong-Tsai Hseih, Mark A. Licon, Johannes Lenkl, Kai Li
  • Patent number: 8769805
    Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: July 8, 2014
    Assignee: Avery Dennison Corporation
    Inventors: James P. Coleman, David N. Edwards, Ian J. Forster, Pradeep S. Iyer, Mark A. Licon
  • Publication number: 20130248608
    Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
    Type: Application
    Filed: April 26, 2013
    Publication date: September 26, 2013
    Applicant: Avery Dennison Corporation
    Inventors: James P. COLEMAN, David N. EDWARDS, Ian J. FORSTER, Pradeep IYER, Mark A. LICON
  • Publication number: 20130245174
    Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.
    Type: Application
    Filed: May 13, 2013
    Publication date: September 19, 2013
    Applicant: Avery Dennison Corporation
    Inventors: Kourosh KIAN, Souphong LEE, Dong-Tsai HSEIH, Mark A. LICON, Johannes LENKL, Kai LI
  • Publication number: 20130133532
    Abstract: A system is disclosed for printing, activating and applying a flow of linerless activatable labels to a flow of items to be labeled. An activatable adhesive is formulated to readily absorb energy from a given radiation source, an activatable adhesive linerless label incorporates such the activatable adhesive. Related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.
    Type: Application
    Filed: November 30, 2011
    Publication date: May 30, 2013
    Applicant: Avery Dennison Corporation
    Inventors: Kourosh Kian, Johannes Lenkl, Dong-Tsai Hseih, Mark A. Licon, David N. Edwards, Rishikesh K. Bharadwaj, Pradeep Mallya, Pradeep Iyer
  • Publication number: 20120216951
    Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.
    Type: Application
    Filed: September 1, 2010
    Publication date: August 30, 2012
    Applicant: AVERY DENNISON CORPORATION
    Inventors: Kourosh Kian, Souphong Lee, Dong-Tsai Hseih, Mark A. Licon, David N. Edwards, Johannes Lenkl, Rishikesh K. Bharadwaj, Prakash Mallya, Kai Li
  • Patent number: 7930815
    Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: April 26, 2011
    Assignee: Avery Dennison Corporation
    Inventors: James P. Coleman, David N. Edwards, Ian J. Forster, Pradeep S. Iyer, Mark A. Licon
  • Publication number: 20100283615
    Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.
    Type: Application
    Filed: July 23, 2010
    Publication date: November 11, 2010
    Applicant: AVERY DENNISON CORPORATION
    Inventors: James P. COLEMAN, David N. EDWARDS, Ian J. FORSTER, Pradeep S. IYER, Mark A. LICON