Patents by Inventor Mark A. Licon
Mark A. Licon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9200186Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.Type: GrantFiled: September 1, 2010Date of Patent: December 1, 2015Assignee: Avery Dennison CorporationInventors: Kourosh Kian, Souphong Lee, Dong-Tsai Hseih, Mark A. Licon, David N. Edwards, Johannes Lenkl, Rishikesh K. Bharadwaj, Prakash Mallya, Kai Li
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Patent number: 9159018Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.Type: GrantFiled: April 26, 2013Date of Patent: October 13, 2015Assignee: Avery Dennison CorporationInventors: James P. Coleman, David N. Edwards, Ian J. Forster, Pradeep Iyer, Mark A. Licon
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Patent number: 8927100Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.Type: GrantFiled: May 13, 2013Date of Patent: January 6, 2015Assignee: Avery Dennison CorporationInventors: Kourosh Kian, Souphong Lee, Dong-Tsai Hseih, Mark A. Licon, Johannes Lenkl, Kai Li
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Patent number: 8769805Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.Type: GrantFiled: July 23, 2010Date of Patent: July 8, 2014Assignee: Avery Dennison CorporationInventors: James P. Coleman, David N. Edwards, Ian J. Forster, Pradeep S. Iyer, Mark A. Licon
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Publication number: 20130248608Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.Type: ApplicationFiled: April 26, 2013Publication date: September 26, 2013Applicant: Avery Dennison CorporationInventors: James P. COLEMAN, David N. EDWARDS, Ian J. FORSTER, Pradeep IYER, Mark A. LICON
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Publication number: 20130245174Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.Type: ApplicationFiled: May 13, 2013Publication date: September 19, 2013Applicant: Avery Dennison CorporationInventors: Kourosh KIAN, Souphong LEE, Dong-Tsai HSEIH, Mark A. LICON, Johannes LENKL, Kai LI
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Publication number: 20130133532Abstract: A system is disclosed for printing, activating and applying a flow of linerless activatable labels to a flow of items to be labeled. An activatable adhesive is formulated to readily absorb energy from a given radiation source, an activatable adhesive linerless label incorporates such the activatable adhesive. Related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.Type: ApplicationFiled: November 30, 2011Publication date: May 30, 2013Applicant: Avery Dennison CorporationInventors: Kourosh Kian, Johannes Lenkl, Dong-Tsai Hseih, Mark A. Licon, David N. Edwards, Rishikesh K. Bharadwaj, Pradeep Mallya, Pradeep Iyer
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Publication number: 20120216951Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.Type: ApplicationFiled: September 1, 2010Publication date: August 30, 2012Applicant: AVERY DENNISON CORPORATIONInventors: Kourosh Kian, Souphong Lee, Dong-Tsai Hseih, Mark A. Licon, David N. Edwards, Johannes Lenkl, Rishikesh K. Bharadwaj, Prakash Mallya, Kai Li
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Patent number: 7930815Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.Type: GrantFiled: October 20, 2006Date of Patent: April 26, 2011Assignee: Avery Dennison CorporationInventors: James P. Coleman, David N. Edwards, Ian J. Forster, Pradeep S. Iyer, Mark A. Licon
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Publication number: 20100283615Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.Type: ApplicationFiled: July 23, 2010Publication date: November 11, 2010Applicant: AVERY DENNISON CORPORATIONInventors: James P. COLEMAN, David N. EDWARDS, Ian J. FORSTER, Pradeep S. IYER, Mark A. LICON