Abstract: Components in an integrated circuit component assembly located in a liquid immersion cooling environment are physically isolated from the immersion fluid. This physical isolation can be provided by seals between, for example, a heat sink attached to the integrated circuit components and an enclosure in which the integrated circuit components are located, a printed circuit board to which the integrated circuit components are attached and an integrated circuit component enclosure, a bolster plate and a heat sink, a ring that encompasses the integrated circuit components and a heat sink, and a ring and an integrated heat spreader that is part of an integrated circuit component. Alternatively, a conformal coating compatible with an immersion fluid can be applied to assembly components to act as a chemical reaction and physical barrier between the immersion fluid and integrated circuit component.

Abstract: A thermal management solution in a mobile computing system is bonded to an integrated circuit component by a thermal interface material layer (TIM layer) that does not require the application of a permanent force to ensure a reliable thermally conductive connection. A leaf spring or other loading mechanism that can apply a permanent force to a TIM layer can be secured to a printed circuit board by fasteners that extend through holes in the board in the vicinity of the integrated circuit component. These holes consume area that could otherwise be used for signal routing. In devices that use a TIM layer that does not require the application of a permanent force, the thermal management solution can be attached to a printed circuit board or chassis at a location remote to the integrated circuit component, where the attachment mechanism does not or minimally interferes with integrated circuit component signal routing.

Abstract: Dynamically modifiable air movers can be modified during operation of a computing system to allow the performance of the fan (air flow, air flow split between exhausts) to be adjusted based on a workload being performed by the system. The physical modifications that an air mover can undergo are physical in nature and include adjusting the placement of one or more cutwaters, expanding or contracting an expandable portion of the fan housing, covering or uncovering an exhaust to provide or remove cooling to memory components, and moving a slidable strip to extend or withdraw from an exhaust. Causing one or more of these physical modifications to be made can be performed in response to the system determining that a temperature, rate of temperature change, power consumption level, rate of power consumption level change of the system or system components exceeds or has dropped below a threshold level.

Abstract: Methods and apparatus relating for direct attach dock cooling leveraging Maximum Silicon Junction Temperature (Tj) control are described. In an embodiment, performance of a mobile computing device is increased based at least in part on an indication that the mobile computing device is coupled to a dock. The dock includes a cooling fan proximate to a hotspot on a back skin of the mobile computing device. Other embodiments are also disclosed and claimed.

Abstract: Methods and apparatus relating for direct attach dock cooling leveraging Maximum Silicon Junction Temperature (Tj) control are described. In an embodiment, performance of a mobile computing device is increased based at least in part on an indication that the mobile computing device is coupled to a dock. The dock includes a cooling fan proximate to a hotspot on a back skin of the mobile computing device. Other embodiments are also disclosed and claimed.

Abstract: Embodiments are generally directed to dynamically adjustable three-dimensional (3D) goggles. An embodiment of an apparatus includes a frame; a display for 3D images; and a dynamically adjustable lens assembly including one or more lenses for viewing the 3D images; wherein a focal length of the lens assembly is dynamically adjustable in response to received focal distance data.

Abstract: In some embodiments, a device includes power source circuitry, a circuit board supporting electrical components to receive electrical power from the power source circuitry. The device further includes a housing forming a cavity including the circuit board, and thermal energy storage material held in the cavity, wherein the thermal energy storage material is distributed throughout various places in the cavity. Additional embodiments are described.