Abstract: Disclosed herein are systems and methods for neural interfaces. Neural interfaces may form minimally invasive and high-scalable bidirectional brain-computer interfaces, which may be used in the treatment of a variety of disorders of the brain and nervous system. Disclosed are methods for a minimally invasive technique for implanting neural interfaces, a neural interface configured to be placed between the brain and the dura and configured to record from and/or stimulate the cortical surface. Also disclosed are methods for attaching a plurality of microelectrode arrays to form a neural interface device, and fabricating neural interfaces including microelectrode arrays and pockets to facilitate their insertion. The disclosed systems and methods also include neural decoding techniques.

Abstract: A system for providing raw water for cooling of one or more Auxiliary Systems of a Luxury Boat, when the Luxury Boat is in Temporary Dry Storage involves a pump, external to the Luxury Boat, a controller coupled to the external pump and a sensor coupled to a boat-based pump controller on the Luxury Boat. The sensor is configured to sense a trigger signal from the boat-based pump controller indicating that raw water is to be pumped to the one or more Auxiliary Systems and send a signal to the controller that will cause the controller to start the external pump pumping raw water to the Luxury Boat. A related method for controlling raw water supply to one or more Auxiliary Systems of a Luxury Boat, when the Luxury Boat is in Temporary Dry Storage is also described.

Abstract: A shelving and package locating system for delivery vehicles includes one or more shelves for storing packages within a delivery vehicle during delivery. Each package is associated with both a geographic delivery address and an assigned location on a particular shelf within the delivery vehicle. A GPS unit determines the location of the delivery vehicle during delivery, and a computer provides the shelf location of a particular package when that package's delivery-location information substantially corresponds to vehicle location information. Several embodiments exist for registering the location of the package in the vehicle at load time, such as scanned location indicia, light sensors on shelves, pressure sensors on shelves, pressure sensors on the floor of the vehicle, and light spot. Several embodiments exist for locating the package in the vehicle at delivery time, such as a pick-to-light system that employs variable length lighting and a light pointer system that generates a light spot.

Abstract: A shelving and package locating system for delivery vehicles includes one or more shelves for storing packages within a delivery vehicle during delivery. Each package is associated with both a geographic delivery address and an assigned location on a particular shelf within the delivery vehicle. A GPS unit determines the location of the delivery vehicle during delivery, and a computer provides the shelf location of a particular package when that package's delivery-location information substantially corresponds to vehicle location information. Several embodiments exist for registering the location of the package in the vehicle at load time, such as scanned location indicia, light sensors on shelves, pressure sensors on shelves, pressure sensors on the floor of the vehicle, and light spot. Several embodiments exist for locating the package in the vehicle at delivery time, such as a pick-to-light system that employs variable length lighting and a light pointer system that generates a light spot.

Abstract: Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.

Abstract: Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.

Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.

Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

Abstract: Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.

Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bight copper or copper alloy on substrates.

Abstract: Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.

Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.

Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper on substrates.

Abstract: A heterocyclic nitrogen and glycol containing solvent swell composition and method of using the composition. The solvent swell compositions may contain high flash point solvents and water. The solvent swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The heterocyclic nitrogen and glycol solvent swell composition also desmears resin material from substrates. The heterocyclic and glycol solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by suitable plating methods.

Abstract: A lactone solvent swell composition and method of using the composition. The lactone swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The lactone solvent swell compositions also desmear resin material from substrates. The lactone solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by electroless plating.

Abstract: The invention includes processes for combined polymer surface treatment and metal deposition. Processes of the invention include forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, manganese, nickel, rhodium, or vanadium. The activator can be suitably oxidized to a higher oxidation state electrochemically. Exposing a part to be plated (such as an organic resin, e.g. a printed circuit board substrate) to the solution enables reactive hydroxyl species (e.g. hydroxyl radicals) to be generated and to texture the polymer surface. Such texturing facilitates good plated metal adhesion. As part of this contacting process sufficient time is allowed for both surface texturing to take place and for the oxidized metal activator to adsorb onto said part. The part is then contacted with a reducing agent capable of reducing the metal activator to a lower ionic form, or a lower oxidation state.

Abstract: A method for desmearing resin accretions from the surface of a substrate and texturing resins by generating a free radical which attacks and removes the resin accretions and textures the resin.

Abstract: A combined adhesion promotion method of a metal to a non-conductive substrate and directly metallizing the non-conductive substrate with the metal. The method involves texturing a non-conductive substrate with a cobalt etch followed by applying a sulfide to the textured non-conductive substrate to provide an electrically conductive surface on the non-conductive substrate. After the surface of the non-conductive substrate has been made electrically conductive, the surface of the non-conductive substrate can be directly metallized. The method reduces the number of process steps for direct metallization of a non-conductive substrate. Thus, the method is more efficient in contrast to conventional methods of metallizing a non-conductive substrate.

Abstract: A combined adhesion promotion method of a metal to a non-conductive substrate and directly metallizing the non-conductive substrate with the metal. The method involves texturing a non-conductive substrate with a cobalt etch followed by applying a sulfide to the textured non-conductive substrate to provide an electrically conductive surface on the non-conductive substrate. After the surface of the non-conductive substrate has been made electrically conductive, the surface of the non-conductive substrate can be directly metallized. The method reduces the number of process steps for direct metallization of a non-conductive substrate. Thus, the method is more efficient in contrast to conventional methods of metallizing a non-conductive substrate.

Abstract: A heterocyclic nitrogen and glycol containing solvent swell composition and method of using the composition. The solvent swell compositions may contain high flash point solvents and water. The solvent swell composition is used to condition resinous material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that a high integrity bond is formed between the textured resinous material and the deposited metal. Such a bond between the metal and the resinous material prevents de-lamination of the metal and resin bond. The heterocyclic nitrogen and glycol solvent swell composition also desmears resin material from substrates. The heterocyclic and glycol solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by suitable plating methods.