Patents by Inventor Mark A. SCALISI

Mark A. SCALISI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating method
    Patent number: 9809891
    Abstract: Copper electroplating baths having a surface tension of ?40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: November 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Matthew A. Thorseth, Mark A. Scalisi, Luis A. Gomez, Bryan Lieb, Rebecca Lea Hazebrouck, Mark Lefebvre
  • PLATING METHOD
    Publication number: 20150376807
    Abstract: Copper electroplating baths having a surface tension of ?40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
    Type: Application
    Filed: June 30, 2014
    Publication date: December 31, 2015
    Inventors: Matthew A. THORSETH, Mark A. SCALISI, Luis A. GOMEZ, Bryan LIEB, Rebecca Lea Hazebrouck, Mark LEFEBVRE