Patents by Inventor Mark A. Schmisseur

Mark A. Schmisseur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12204471
    Abstract: In an example, there is disclosed a host-fabric interface (HFI), including: an interconnect interface to communicatively couple the HFI to an interconnect; a network interface to communicatively couple the HFI to a network; network interface logic to provide communication between the interconnect and the network; a coprocessor configured to provide an offloaded function for the network; a memory; and a caching agent configured to: designate a region of the memory as a shared memory between the HFI and a core communicatively coupled to the HFI via the interconnect; receive a memory operation directed to the shared memory; and issue a memory instruction to the memory according to the memory operation.
    Type: Grant
    Filed: September 7, 2023
    Date of Patent: January 21, 2025
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Daniel Rivas Barragan, Kshitij A. Doshi, Mark A. Schmisseur
  • Publication number: 20240421025
    Abstract: A semiconductor chip package is described. The semiconductor chip package has a substrate. The substrate has side I/Os on the additional surface area of the substrate. The side I/Os are coupled to I/Os of a semiconductor chip within the semiconductor chip package. A cooling assembly has also been described. The cooling assembly has a passageway to guide a cable to connect to a semiconductor chip's side I/Os that are located between a base of a cooling mass and an electronic circuit board that is between a bolster plate and a back plate and that is coupled to second I/Os of the semiconductor chip through a socket that the semiconductor chip's package is plugged into.
    Type: Application
    Filed: December 16, 2021
    Publication date: December 19, 2024
    Inventors: Lianchang DU, Jeffory L. SMALLEY, Srikant NEKKANTY, Eric W. BUDDRIUS, Yi ZENG, Xinjun ZHANG, Maoxin YIN, Zhichao ZHANG, Chen ZHANG, Yuehong FAN, Mingli ZHOU, Guoliang YING, Yinglei REN, Chong J. ZHAO, Jun LU, Kai WANG, Timothy Glen HANNA, Vijaya K. BODDU, Mark A. SCHMISSEUR, Lijuan FENG
  • Publication number: 20240396852
    Abstract: There is disclosed in one example an application-specific integrated circuit (ASIC), including: an artificial intelligence (AI) circuit; and circuitry to: identify a flow, the flow including traffic diverted from a core cloud service of a network to be serviced by an edge node closer to an edge of the network than to the core of the network; receive telemetry related to the flow, the telemetry including fine-grained and flow-level network monitoring data for the flow; operate the AI circuit to predict, from the telemetry, a future service-level demand for the edge node; and cause a service parameter of the edge node to be tuned according to the prediction.
    Type: Application
    Filed: August 1, 2024
    Publication date: November 28, 2024
    Applicant: Intel Corporation
    Inventors: Francesc Guim Bernat, Karthik Kumar, Thomas Willhalm, Mark A. Schmisseur, Timothy Verrall
  • Publication number: 20240378160
    Abstract: In accordance with embodiments disclosed herein, there are provided methods, systems, mechanisms, techniques, and apparatuses for presentation of direct accessed storage under a logical drive model; for implementing a distributed architecture for cooperative NVM Data protection; data mirroring for consistent SSD latency; for boosting a controller's performance and RAS with DIF support via concurrent RAID processing; for implementing arbitration and resource schemes of a doorbell mechanism, including doorbell arbitration for fairness and prevention of attack congestion; and for implementing multiple interrupt generation using a messaging unit and NTB in a controller through use of an interrupt coalescing scheme.
    Type: Application
    Filed: July 22, 2024
    Publication date: November 14, 2024
    Inventors: Thomas M. Slaight, Sivakumar Radhakrishnan, Mark Schmisseur, Pankaj Kumar, Saptarshi Mondal, Sin S. Tan, David C. Lee, Marc T. Jones, Geetani R. Edirisooriya, Bradley A. Burres, Brian M. Leitner, Kenneth C. Haren, Michael T. Klinglesmith, Matthew R. Wilcox, Eric J. Dahlen
  • Publication number: 20240320179
    Abstract: There is disclosed an example of an artificial intelligence (AI) system, including: a first hardware platform; a fabric interface configured to communicatively couple the first hardware platform to a second hardware platform; a processor hosted on the first hardware platform and programmed to operate on an AI problem; and a first training accelerator, including: an accelerator hardware; a platform inter-chip link (ICL) configured to communicatively couple the first training accelerator to a second training accelerator on the first hardware platform without aid of the processor; a fabric ICL to communicatively couple the first training accelerator to a third training accelerator on a second hardware platform without aid of the processor; and a system decoder configured to operate the fabric ICL and platform ICL to share data of the accelerator hardware between the first training accelerator and second and third training accelerators without aid of the processor.
    Type: Application
    Filed: May 31, 2024
    Publication date: September 26, 2024
    Applicant: Intel Corporation
    Inventors: Francesc Guim Bernat, Da-Ming Chiang, Kshitij A. Doshi, Suraj Prabhakaran, Mark A. Schmisseur
  • Patent number: 12088507
    Abstract: There is disclosed in one example an application-specific integrated circuit (ASIC), including: an artificial intelligence (AI) circuit; and circuitry to: identify a flow, the flow including traffic diverted from a core cloud service of a network to be serviced by an edge node closer to an edge of the network than to the core of the network; receive telemetry related to the flow, the telemetry including fine-grained and flow-level network monitoring data for the flow; operate the AI circuit to predict, from the telemetry, a future service-level demand for the edge node; and cause a service parameter of the edge node to be tuned according to the prediction.
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: September 10, 2024
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Karthik Kumar, Thomas Willhalm, Mark A. Schmisseur, Timothy Verrall
  • Patent number: 12079149
    Abstract: In accordance with embodiments disclosed herein, there are provided methods, systems, mechanisms, techniques, and apparatuses for presentation of direct accessed storage under a logical drive model; for implementing a distributed architecture for cooperative NVM Data protection; data mirroring for consistent SSD latency; for boosting a controller's performance and RAS with DIF support via concurrent RAID processing; for implementing arbitration and resource schemes of a doorbell mechanism, including doorbell arbitration for fairness and prevention of attack congestion; and for implementing multiple interrupt generation using a messaging unit and NTB in a controller through use of an interrupt coalescing scheme.
    Type: Grant
    Filed: February 8, 2023
    Date of Patent: September 3, 2024
    Assignee: SK hynix NAND Product Solutions Corp.
    Inventors: Thomas M. Slaight, Sivakumar Radhakrishnan, Mark Schmisseur, Pankaj Kumar, Saptarshi Mondal, Sin S. Tan, David C. Lee, Marc T. Jones, Geetani R. Edirisooriya, Bradley A. Burres, Brian M. Leitner, Kenneth C. Haren, Michael T. Klinglesmith, Matthew R. Wilcox, Eric J. Dahlen
  • Publication number: 20240256685
    Abstract: An embodiment of an electronic apparatus may include one or more substrates, and logic coupled to the one or more substrates, the logic to process memory operation requests from a memory controller, and provide a front end interface to remote pooled memory hosted at a near edge device. An embodiment of another electronic apparatus may include local memory and logic communicatively coupled the local memory, the logic to allocate a range of the local memory as remote pooled memory, and provide a back end interface to the remote pooled memory for memory requests from a far edge device. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: April 8, 2024
    Publication date: August 1, 2024
    Applicant: Intel Corporation
    Inventors: Francesc Guim Bernat, Karthik Kumar, Mark Schmisseur, Thomas Willhalm
  • Patent number: 12038861
    Abstract: There is disclosed an example of an artificial intelligence (AI) system, including: a first hardware platform; a fabric interface configured to communicatively couple the first hardware platform to a second hardware platform; a processor hosted on the first hardware platform and programmed to operate on an AI problem; and a first training accelerator, including: an accelerator hardware; a platform inter-chip link (ICL) configured to communicatively couple the first training accelerator to a second training accelerator on the first hardware platform without aid of the processor; a fabric ICL to communicatively couple the first training accelerator to a third training accelerator on a second hardware platform without aid of the processor; and a system decoder configured to operate the fabric ICL and platform ICL to share data of the accelerator hardware between the first training accelerator and second and third training accelerators without aid of the processor.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: July 16, 2024
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Da-Ming Chiang, Kshitij A. Doshi, Suraj Prabhakaran, Mark A. Schmisseur
  • Patent number: 12019768
    Abstract: An embodiment of an electronic apparatus may include one or more substrates, and logic coupled to the one or more substrates, the logic to process memory operation requests from a memory controller, and provide a front end interface to remote pooled memory hosted at a near edge device. An embodiment of another electronic apparatus may include local memory and logic communicatively coupled the local memory, the logic to allocate a range of the local memory as remote pooled memory, and provide a back end interface to the remote pooled memory for memory requests from a far edge device. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: June 25, 2024
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Karthik Kumar, Mark Schmisseur, Thomas Willhalm
  • Publication number: 20240179078
    Abstract: Embodiments may be generally directed to techniques to cause communication of a registration request between a first end-point and a second end-point of an end-to-end path, the registration request to establish resource load monitoring for one or more resources of the end-to-end path, receive one or more acknowledgements indicating resource loads for each of the one or more resources of the end-to-end path, at least one of the acknowledgements to indicate a resource of the one or more resources is not meeting a threshold requirement for the end-to-end path, and perform an action for communication traffic utilizing the one or more resources based on the acknowledgement.
    Type: Application
    Filed: December 1, 2023
    Publication date: May 30, 2024
    Applicant: INTEL CORPORATION
    Inventors: FRANCESC GUIM BERNAT, KSHITIJ A. DOSHI, DANIEL RIVAS BARRAGAN, MARK A. SCHMISSEUR, STEEN LARSEN
  • Patent number: 11994997
    Abstract: Systems, apparatuses and methods may provide for a memory controller to manage quality of service enforcement and migration between local and pooled memory. A memory controller may include logic to communicate with a local memory and with a pooled memory controller to track memory page usage on a per application basis, instruct the pooled memory controller to perform a quality of service enforcement in response to a determination that an application is latency bound or bandwidth bound, wherein the determination that the application is latency bound or bandwidth bound is based on a cycles per instruction determination, and instruct a Direct Memory Access engine to perform a migration from a remote memory to the local memory in response to a determination that the quality of service cannot be enforced.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Karthik Kumar, Mark A. Schmisseur
  • Patent number: 11983408
    Abstract: An embodiment of an electronic apparatus may include one or more substrates, and logic coupled to the one or more substrates, the logic to allocate a first memory portion to a first application as a combination of a local memory and remote memory, wherein the remote memory is shared between multiple compute nodes, and manage a first memory balloon associated with the first memory portion based on two or more memory tiers associated with the local memory and the remote memory. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: May 3, 2023
    Date of Patent: May 14, 2024
    Assignee: Intel Corporation
    Inventors: Rasika Subramanian, Lidia Warnes, Francesc Guim Bernat, Mark A. Schmisseur, Durgesh Srivastava
  • Patent number: 11907136
    Abstract: An apparatus and/or system is described including a memory device including a memory range and a temporal data management unit (TDMU) coupled to the memory device to receive from an interface, the memory range and a temporal range corresponding to validity of data in the memory range, check the temporal range against a time and/or date value provided by a timer or clock to identify the data in the memory range as expired, and invalidate the data that is expired in the memory device. In some embodiments, the TDMU includes hardware logic that resides on a memory module with the memory device and is coupled to invalidate expired data when the memory module is decoupled from the interface. Other embodiments may be disclosed and claimed.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: February 20, 2024
    Assignee: Intel Corporation
    Inventors: Ginger H. Gilsdorf, Karthik Kumar, Mark A. Schmisseur, Thomas Willhalm, Francesc Guim Bernat
  • Publication number: 20240045814
    Abstract: In an example, there is disclosed a host-fabric interface (HFI), including: an interconnect interface to communicatively couple the HFI to an interconnect; a network interface to communicatively couple the HFI to a network; network interface logic to provide communication between the interconnect and the network; a coprocessor configured to provide an offloaded function for the network; a memory; and a caching agent configured to: designate a region of the memory as a shared memory between the HFI and a core communicatively coupled to the HFI via the interconnect; receive a memory operation directed to the shared memory; and issue a memory instruction to the memory according to the memory operation.
    Type: Application
    Filed: September 7, 2023
    Publication date: February 8, 2024
    Applicant: Intel Corporation
    Inventors: Francesc Guim Bernat, Daniel Rivas Barragan, Kshitij A. Doshi, Mark A. Schmisseur
  • Patent number: 11870662
    Abstract: Embodiments may be generally directed to techniques to cause communication of a registration request between a first end-point and a second end-point of an end-to-end path, the registration request to establish resource load monitoring for one or more resources of the end-to-end path, receive one or more acknowledgements indicating resource loads for each of the one or more resources of the end-to-end path, at least one of the acknowledgements to indicate a resource of the one or more resources is not meeting a threshold requirement for the end-to-end path, and perform an action for communication traffic utilizing the one or more resources based on the acknowledgement.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: January 9, 2024
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Kshitij A. Doshi, Daniel Rivas Barragan, Mark A. Schmisseur, Steen Larsen
  • Patent number: 11809338
    Abstract: In an example, there is disclosed a host-fabric interface (HFI), including: an interconnect interface to communicatively couple the HFI to an interconnect; a network interface to communicatively couple the HFI to a network; network interface logic to provide communication between the interconnect and the network; a coprocessor configured to provide an offloaded function for the network; a memory; and a caching agent configured to: designate a region of the memory as a shared memory between the HFI and a core communicatively coupled to the HFI via the interconnect; receive a memory operation directed to the shared memory; and issue a memory instruction to the memory according to the memory operation.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: November 7, 2023
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Daniel Rivas Barragan, Kshitij A. Doshi, Mark A. Schmisseur
  • Patent number: 11797343
    Abstract: Data management for edge architected computing systems extends current storage and memory schemes of edge resources to expose interfaces to allow a device, such as an endpoint or client device, or another edge resource, to specify criteria for managing data originating from the device and stored in an edge resource, and extends the storage and memory controllers to manage data in accordance with the criteria, including removing stored data that no longer satisfies the criteria. The criteria includes a temporal hint to specify a time after which the data can be removed, a physical hint to specify a list of edge resources outside of which the data can be removed, an event-based hint to specify an event after which the data can be removed, and a quality of service condition to modify the time specified in the temporal hint based on a condition, such as memory and storage capacity of the edge resource in which the data is managed.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: October 24, 2023
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Ramanathan Sethuraman, Karthik Kumar, Mark A. Schmisseur, Brinda Ganesh
  • Publication number: 20230333738
    Abstract: An embodiment of an electronic apparatus may include one or more substrates, and logic coupled to the one or more substrates, the logic to allocate a first memory portion to a first application as a combination of a local memory and remote memory, wherein the remote memory is shared between multiple compute nodes, and manage a first memory balloon associated with the first memory portion based on two or more memory tiers associated with the local memory and the remote memory. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: May 3, 2023
    Publication date: October 19, 2023
    Applicant: Intel Corporation
    Inventors: Rasika Subramanian, Lidia Warnes, Francesc Guim Bernat, Mark A. Schmisseur, Durgesh Srivastava
  • Patent number: 11704424
    Abstract: An embodiment of a semiconductor apparatus may include technology to receive data with a unique identifier, and bypass encryption logic of a media controller based on the unique identifier. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: July 18, 2023
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Mark Schmisseur, Kshitij Doshi, Kapil Sood, Tarun Viswanathan