Abstract: Novel modifying agents contain a sharply-melting crystalline polymer ingredient, preferably a side chain crystalline (SCC) ingredient, and an active chemical ingredient. Such modifying agents, especially when in the form of particles, can be placed in contact with a matrix, will not modify the matrix below the crystalline melting point Tp, but will rapidly modify the matrix above Tp. The active chemical ingredient can react with the matrix, catalyze a reaction of the matrix, or inhibit a reaction of the matrix. Particularly useful compositions are polymer precursors which are storage-stable at low temperatures but which are rapidly converted to crosslinked resins when heated to temperatures above Tp, optionally in the presence of light.

Abstract: Novel modifying agents contain a sharply-melting crystalline polymer ingredient, preferably a side chain crystalline (SCC) ingredient, and an active chemical ingredient. Such modifying agents, especially when in the form of particles, can be placed in contact with a matrix, will not modify the matrix below the crystalline melting point Tp, but will rapidly modify the matrix above Tp. The active chemical ingredient can react with the matrix, catalyze a reaction of the matrix, or inhibit a reaction of the matrix. Particularly useful compositions are polymer precursors which are storage-stable at low temperatures but which are rapidly converted to crosslinked resins when heated to temperatures above Tp, optionally in the presence of light.

Abstract: The present invention provides a modeling paste comprising a latent material which can be applied as a thick layer to a substrate and which after activation rapidly crosslinks to a machinable surface.

Abstract: A two component adhesive composition which is curable by induction heating is provided. The presence of an effective amount of conductive carbon black along with an effective amount of an electromagnetic energy absorbing material such as iron oxide in the adhesive composition allows one to reduce the time for induction curing and/or allow the use of low frequency induction generators (less than or equal to 10 KHz) in the bonding of fiber reinforced engineering thermoset, thermoplastic materials and other plastics.