Abstract: An electronic assembly is fabricated by tinning a solder to the electrical bonding pads of a printed circuit board, and applying an adhesive, preferably a filled polyurethane adhesive, to the component that is to be bonded to the printed circuit board. The component is contacted to its bonding location on the printed circuit board, and the electrical contact on the component is contacted to the tinned bonding pads. The assembly is heated in a single solder temperature/time reflow cycle to simultaneously cure the adhesive and solder the electrical contacts to the bonding pads.

Abstract: A thermal transfer adhesive composition which is applied after electronic components have been installed on a printed wiring board, comprising:(a) 30 to 70 weight percent of an aliphatic diisocyanate or triisocyanate prepolymer;(b) 5 to 15 weight percent of a polyether diol or triol;(c) 20 to 40 weight percent of castor oil;(d) 5 to 20 weight percent of an epoxy resin containing 2 or more hydroxyl group;(e) 0.006 to 0.008 weight percent of a catalyst for the reaction of isocyanate groups with hydroxyl groups. The cured product is hydrolytically stable at 185.degree. F. and 95 percent relative humidity and has a good storage life when frozen. Alternatively, the composition may also include a pigment.