Abstract: The present invention provides a thermally conductive material which can be used as a heat sink in a multi-chip module or multilayer circuit structure. The material is formed by firing a composition including a solids portion comprising from about 1% to about 30% by weight glass and from about 70% to about 98% by weight silver. The glass comprises in weight percent from about 5% to about 60% B.sub.2 O.sub.3, from about 30% to about 90% SiO.sub.2, up to 10% Li.sub.2 O, up to 10% Na.sub.2 O, up to 10% K.sub.2 O and up to 10% Al.sub.2 O.sub.3. The material may be formed using a second glass selected from the group comprising of (i) a glass comprising in weight percent from about 10% to about 60% CaO, from about 5% to about 55% B.sub.2 O.sub.3 and from about 5% to about 55% SiO.sub.2 ; and (ii) a glass comprising in weight percent from about 35% to about 70% SiO.sub.2, from about 20% to about 45% Al.sub.2 O.sub.3, from about 0% to about 8% BaO and from about 5% to about 30% MgO.

Abstract: Monovinylidene aromatic polymer compositions which have good combinations of strength, heat resistance and melt flow properties, are produced by, in effect, adding minor amounts of high molecular weight monovinylidene aromatic polymers to major amounts of intermediate molecular weight polymers. These compositions can be advantageously produced by feeding previously polymerized high molecular weight polymer, dissolved in monomer, into a polymerization zone or reactor wherein the intermediate molecular weight polymer is produced in the presence of the high molecular weight polymer.