Abstract: A practical solid-state battery composed primarily of ceramic or glass materials and containing no liquid, gel or polymeric electrolytes. The invention utilizes solid-state electrolyte materials with solid-state anode and cathode materials along with construction concepts utilized in the multi layered ceramic capacitor (MLCC) industry to result in a compact primary or secondary battery.

Abstract: The invention relates to a convertible vehicle (1) comprising a roof (2) provided with a flexible roof covering (4) in at least certain areas, said roof covering being gripped from below by one or several bows (6, 7) which are arranged in a transversal manner in relation to the direction of travel (F). At least one bow (6;7) is made of several pieces and comprises a central area (9) which is connected to lateral fittings (10) and is configured in such a manner that securing means are provided (16) in order to connect the central part (9) and the fittings (10). When the roof is closed, said securing means are arranged in the region of the respective bow (6, 7) and are at least approximately parallel to the extension plane (17;18) of the external roof covering (4).

Abstract: The invention relates to a convertible vehicle (1) comprising a roof (2) provided with a flexible roof covering (4) in at least certain areas, said roof covering being gripped from below by one or several bows (6, 7) which are arranged in a transversal manner in relation to the direction of travel (F). At least one bow (6;7) is made of several pieces and comprises a central area (9) which is connected to lateral fittings (10) and is configured in such a manner that securing means are provided (16) in order to connect the central part (9) and the fittings (10). When the roof is closed, said securing means are arranged in the region of the respective bow (6. 7) and are at least approximately parallel to the extension plane (17;18) of the external roof covering (4).

Abstract: A protective disk for protecting a semiconductor wafer during processing includes an adhesive layer configured to adhere to the semiconductor wafer and a support layer coupled to the adhesive layer configured to provide strength and stiffness to the semiconductor wafer during processing. In one aspect of the invention, the protective disk is soluble in a mildly alkaline or mildly acidic solution. In another aspect, the adhesive layer comprises a high molecular weight polymer. In another aspect, the support layer comprises a polymer and a filler. The present invention may enable a robust, cost-effective, high-volume, automated process for thinning semiconductor wafers below 150 ?m, and for subsequent process steps of stress relief and transfer to a dicing frame for die singulation. Additionally, the invention enables use of existing toolsets and processes to produce thinner substrates than conventionally achievable.

Abstract: A protective disk for protecting a semiconductor wafer during processing includes an adhesive layer configured to adhere to the semiconductor wafer and a support layer coupled to the adhesive layer configured to provide strength and stiffness to the semiconductor wafer during processing. In one aspect of the invention, the protective disk is soluble in a mildly alkaline or mildly acidic solution. In another aspect, the adhesive layer comprises a high molecular weight polymer. In another aspect, the support layer comprises a polymer and a filler. The present invention may enable a robust, cost-effective, high-volume, automated process for thinning semiconductor wafers below 150 ?m, and for subsequent process steps of stress relief and transfer to a dicing frame for die singulation. Additionally, the invention enables use of existing toolsets and processes to produce thinner substrates than conventionally achievable.

Abstract: The present invention provides a thermally conductive material which can be used as a heat sink in a multi-chip module or multilayer circuit structure. The material is formed by firing a composition including a solids portion comprising from about 1% to about 30% by weight glass and from about 70% to about 98% by weight silver. The glass comprises in weight percent from about 5% to about 60% B.sub.2 O.sub.3, from about 30% to about 90% SiO.sub.2, up to 10% Li.sub.2 O, up to 10% Na.sub.2 O, up to 10% K.sub.2 O and up to 10% Al.sub.2 O.sub.3. The material may be formed using a second glass selected from the group comprising of (i) a glass comprising in weight percent from about 10% to about 60% CaO, from about 5% to about 55% B.sub.2 O.sub.3 and from about 5% to about 55% SiO.sub.2 ; and (ii) a glass comprising in weight percent from about 35% to about 70% SiO.sub.2, from about 20% to about 45% Al.sub.2 O.sub.3, from about 0% to about 8% BaO and from about 5% to about 30% MgO.

Abstract: Monovinylidene aromatic polymer compositions which have good combinations of strength, heat resistance and melt flow properties, are produced by, in effect, adding minor amounts of high molecular weight monovinylidene aromatic polymers to major amounts of intermediate molecular weight polymers. These compositions can be advantageously produced by feeding previously polymerized high molecular weight polymer, dissolved in monomer, into a polymerization zone or reactor wherein the intermediate molecular weight polymer is produced in the presence of the high molecular weight polymer.