Patents by Inventor Mark A. Whitney

Mark A. Whitney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Variable melting point solders
    Patent number: 9095936
    Abstract: The present invention relates to variable melting point solder formulations. The solder is comprised of at least one base metal or base metal alloy, preferably alloyed with at least one melting point depressant metal, such that the solidus point of the solder composition is reduced to an initial solidus temperature. Said base metal or base metal alloy, alloyed with at least one melting point depressant metal is mixed with at least one additive metal or additive metal alloy. When heated to a process temperature above said initial solidus temperature, a reaction occurs between the melting point depressant metal, and the additive metal, such that solidification occurs at the process temperature via the formation of intermetallic phases, effectively increasing the solidus of the base metal, and of the overall solder.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: August 4, 2015
    Assignee: DYNAJOIN CORPORATION
    Inventors: Douglas J. McIsaac, Mark A. Whitney, Stephen F. Corbin
  • VARIABLE MELTING POINT SOLDERS
    Publication number: 20120055586
    Abstract: The present invention relates to variable melting point solder formulations. The solder is comprised of at least one base metal or base metal alloy, preferably alloyed with at least one melting point depressant metal, such that the solidus point of the solder composition is reduced to an initial solidus temperature. Said base metal or base metal alloy, alloyed with at least one melting point depressant metal is mixed with at least one additive metal or additive metal alloy. When heated to a process temperature above said initial solidus temperature, a reaction occurs between the melting point depressant metal, and the additive metal, such that solidification occurs at the process temperature via the formation of intermetallic phases, effectively increasing the solidus of the base metal, and of the overall solder.
    Type: Application
    Filed: August 26, 2011
    Publication date: March 8, 2012
    Applicant: DYNAJOIN CORPORATION
    Inventors: Douglas J. McIsaac, Mark A. Whitney, Stephen F. Corbin