Abstract: A charging device for connecting an electrical energy store of a motor vehicle to a charging station for electrical energy includes a charging cable having at least one line for conducting a charging current and at least one connection element via which the charging cable is connectable to a corresponding connection element between the energy store and the charging station. At least one latent heat store is provided on the charging cable and/or on the at least one connection element and can be used to absorb heat generated during the charging process.

Abstract: A charging device for connecting an electrical energy store of a motor vehicle to a charging station for electrical energy includes a charging cable having at least one line for conducting a charging current and at least one connection element via which the charging cable is connectable to a corresponding connection element between the energy store and the charging station. At least one latent heat store is provided on the charging cable and/or on the at least one connection element and can be used to absorb heat generated during the charging process.

Abstract: A modular substation (10) for subsea applications includes a plurality of modular DC/AC converters (32) configured for converting DC electrical power transmitted along a DC transmission link (24) into AC electrical power for supplying to a plurality of subsea loads (56). The plurality of modular DC/AC converters (32) is configured to couple in series to the DC transmission link (24) and couple in parallel to an AC distribution network (52). At least a first modular DC/AC converter (32) is configured to be selectively electrically and mechanically disconnected from the DC transmission link (24) and the AC distribution network (52) to facilitate maintenance of the first modular DC/AC converters (32) while the AC distribution network (52) continues to supply AC electrical power to at least one of the plurality of subsea loads (56). The modular substation (10) also comprises protection and bypass circuits (26) intended to isolate faulty DC/AC converters (32) and to facilitate safe maintenance and repair.

Abstract: Provided are systems and methods for cooling a power converter. For example, there is provided a controller programmed to control a heat transport rate between a coolant disposed in a cooling system and a power converter coupled thereto by regulating a pressure of the coolant in the cooling system.

Abstract: A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.

Abstract: The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.

Abstract: A cooling system includes one or more heat generating components located within an enclosure. A first conduit is thermally connected to one or more of the heat generating components, and the first conduit is fluidly connected to a distribution manifold and a condensing unit. The condensing unit is located external to the enclosure and above the heat generating components. The distribuition manifold is located below the heat generating components. A second conduit is fluidly connected to the condensing unit and the distribution manifold. The cooling system includes a two-phase cooling medium. The first conduit, condensing unit, second conduit and distribution manifold form a loop in which the cooling medium circulates.

Abstract: The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.

Abstract: Provided are systems and methods for cooling a power converter. For example, there is provided a controller programmed to control a heat transport rate between a coolant disposed in a cooling system and a power converter coupled thereto by regulating a pressure of the coolant in the cooling system.

Abstract: A modular substation (10) for subsea applications includes a plurality of modular DC/AC converters (32) configured for converting DC electrical power transmitted along a DC transmission link (24) into AC electrical power for supplying to a plurality of subsea loads (56). The plurality of modular DC/AC converters (32) is configured to couple in series to the DC transmission link (24) and couple in parallel to an AC distribution network (52). At least a first modular DC/AC converter (32) is configured to be selectively electrically and mechanically disconnected from the DC transmission link (24) and the AC distribution network (52) to facilitate maintenance of the first modular DC/AC converters (32) while the AC distribution network (52) continues to supply AC electrical power to at least one of the plurality of subsea loads (56). The modular substation (10) also comprises protection and bypass circuits (26) intended to isolate faulty DC/AC converters (32) and to facilitate safe maintenance and repair.

Abstract: A submersible power distribution system is provided. The system includes at least one receptacle configured to be exposed to an underwater environment and a plurality of power conversion modules positioned within the at least one receptacle. Each of the plurality of power conversion modules includes a first enclosure configured to be exposed to the underwater environment, the first enclosure defining a first interior cavity configured to have a first pressure. Power conversion modules also include at least one second enclosure positioned within the first interior cavity. The at least one second enclosure defines a second interior cavity configured to have a second pressure that is lower than the first pressure. The at least one second enclosure is configured to restrict exposure of non-pressure-tolerant power electronics in the second interior cavity to the first pressure.

Abstract: A submersible power distribution system is provided. The system includes at least one receptacle configured to be exposed to an underwater environment and a plurality of power conversion modules positioned within the at least one receptacle. Each of the plurality of power conversion modules includes a first enclosure configured to be exposed to the underwater environment, the first enclosure defining a first interior cavity configured to have a first pressure. Power conversion modules also include at least one second enclosure positioned within the first interior cavity. The at least one second enclosure defines a second interior cavity configured to have a second pressure that is lower than the first pressure. The at least one second enclosure is configured to restrict exposure of non-pressure-tolerant power electronics in the second interior cavity to the first pressure.

Abstract: A thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.

Abstract: A cooling device (10) including a chamber having an evaporator section (34) and a condenser section, the condenser section extending from a periphery of the evaporator section (34).