Patents by Inventor Mark Albert Crowder
Mark Albert Crowder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11721792Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.Type: GrantFiled: January 25, 2021Date of Patent: August 8, 2023Assignee: eLux Inc.Inventors: Kenji Alexander Sasaki, Paul J. Schuele, Mark Albert Crowder
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Publication number: 20210151633Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.Type: ApplicationFiled: January 25, 2021Publication date: May 20, 2021Applicant: eLux Inc.Inventors: Kenji Alexander Sasaki, Paul J. Schuele, Mark Albert Crowder
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Patent number: 10930819Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.Type: GrantFiled: February 5, 2019Date of Patent: February 23, 2021Assignee: eLux Inc.Inventors: Kenji Alexander Sasaki, Paul J. Schuele, Mark Albert Crowder
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Patent number: 10804455Abstract: A method is provided for fabricating piezoelectric plates. A sacrificial layer is formed overlying a growth substrate. A template layer, with openings exposing sacrificial layer surfaces, is formed over the sacrificial layer. An adhesion layer/first electrode stack is selectively deposited in the openings overlying the sacrificial layer surfaces, and a piezoelectric material formed in the openings overlying the stack. Then, a second electrode is formed overlying the piezoelectric material. Using the second electrode as a hardmask, the piezoelectric material is etched to form polygon-shaped structures, such as disks, attached to the sacrificial layer surfaces. After removing the template layer and annealing, the polygon-shaped structures are separated from the sacrificial layer. With the proper choice of growth substrate material, the annealing can be performed at a relatively high temperature.Type: GrantFiled: August 2, 2018Date of Patent: October 13, 2020Assignee: eLux, Inc.Inventors: Mark Albert Crowder, Changqing Zhan, Karen Nishimura, Paul Schuele
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Patent number: 10644190Abstract: A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.Type: GrantFiled: January 1, 2018Date of Patent: May 5, 2020Assignee: eLux Inc.Inventors: Changqing Zhan, Paul John Schuele, Mark Albert Crowder, Sean Mathew Garner, Timothy James Kiczenski
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Patent number: 10643870Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.Type: GrantFiled: May 22, 2019Date of Patent: May 5, 2020Assignee: eLux Inc.Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
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Patent number: 10475958Abstract: Embodiments are related to systems and methods for forming and using a top-contact disk.Type: GrantFiled: August 10, 2017Date of Patent: November 12, 2019Assignee: eLux Inc.Inventors: Changqing Zhan, Paul John Schuele, Mark Albert Crowder, Sean Mathew Garner, Timothy James Kiczenski
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Patent number: 10431718Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.Type: GrantFiled: July 2, 2018Date of Patent: October 1, 2019Assignee: eLux Inc.Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
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Publication number: 20190273006Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.Type: ApplicationFiled: May 22, 2019Publication date: September 5, 2019Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
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Patent number: 10347513Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.Type: GrantFiled: January 1, 2018Date of Patent: July 9, 2019Assignee: eLux Inc.Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
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Publication number: 20190181304Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.Type: ApplicationFiled: February 5, 2019Publication date: June 13, 2019Inventors: Kenji Alexander Sasaki, Paul J. Schuele, Mark Albert Crowder
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Patent number: 10230020Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.Type: GrantFiled: July 14, 2017Date of Patent: March 12, 2019Assignee: eLux Inc.Inventors: Kenji Alexander Sasaki, Paul J. Schuele, Mark Albert Crowder
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Publication number: 20180351077Abstract: A method is provided for fabricating piezoelectric plates. A sacrificial layer is formed overlying a growth substrate. A template layer, with openings exposing sacrificial layer surfaces, is formed over the sacrificial layer. An adhesion layer/first electrode stack is selectively deposited in the openings overlying the sacrificial layer surfaces, and a piezoelectric material formed in the openings overlying the stack. Then, a second electrode is formed overlying the piezoelectric material. Using the second electrode as a hardmask, the piezoelectric material is etched to form polygon-shaped structures, such as disks, attached to the sacrificial layer surfaces. After removing the template layer and annealing, the polygon-shaped structures are separated from the sacrificial layer. With the proper choice of growth substrate material, the annealing can be performed at a relatively high temperature.Type: ApplicationFiled: August 2, 2018Publication date: December 6, 2018Inventors: Mark Albert Crowder, Changqing Zhan, Karen Nishimura, Paul Schuele
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Patent number: 10115862Abstract: A method is provided for forming a direct emission display. The method provides a transparent substrate with an array of wells formed in its top surface. A fluid stream is supplied to the substrate top surface comprising a plurality of top-contact light emitting diode (LED) disks. The wells are filled with the LED disks. A first array of electrically conductive lines is formed over the substrate top surface to connect with a first contact of each LED disk, and a second array of electrically conductive lines is formed over the substrate top surface to connect with a second contact of each LED disk. An insulator over the disk exposes an upper disk (e.g., p-doped) contact region. A via is formed through the disk, exposing a center contact region of a lower (e.g., n-doped) disk contact region. Also provided are a top-contact LED disk and direct emission display.Type: GrantFiled: April 7, 2015Date of Patent: October 30, 2018Assignee: eLux Inc.Inventors: Changqing Zhan, Paul John Schuele, Mark Albert Crowder, Sean Mathew Garner, Timothy James Kiczenski
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Patent number: 10115885Abstract: A method is provided for fabricating a thin-film electronic device employing a piezoelectric plate. The method provides a plurality of piezoelectric plates, and a substrate with electronic devices, each electronic device including a top surface well. A piezoelectric plate suspension is formed and flowed over the substrate. In response to the piezoelectric plate suspension flow, piezoelectric plates are captured in the top surface wells. The electric device top surface wells have well bottom surfaces, with bottom electrical contacts formed on the bottom surfaces. Thus, the capture of a piezoelectric plate in a top surface well entails interfacing a piezoelectric plate electrode, either the first electrode or the second electrode, to the bottom electrical contact. Subsequent to capturing the piezoelectric plates in the top surface wells, a thin-film process forms a conductive line overlying the exposed piezoelectric device electrode (i.e., the electrode not connected to the bottom electrical contact).Type: GrantFiled: August 23, 2016Date of Patent: October 30, 2018Assignee: eLux, Inc.Inventors: Mark Albert Crowder, Changqing Zhan, Karen Nishimura, Paul Schuele
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Publication number: 20180309023Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.Type: ApplicationFiled: July 2, 2018Publication date: October 25, 2018Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
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Patent number: 10069061Abstract: A method is provided for fabricating piezoelectric plates. A sacrificial layer is formed overlying a growth substrate. A template layer, with openings exposing sacrificial layer surfaces, is formed over the sacrificial layer. An adhesion layer/first electrode stack is selectively deposited in the openings overlying the sacrificial layer surfaces, and a piezoelectric material formed in the openings overlying the stack. Then, a second electrode is formed overlying the piezoelectric material. Using the second electrode as a hardmask, the piezoelectric material is etched to form polygon-shaped structures, such as disks, attached to the sacrificial layer surfaces. After removing the template layer and annealing, the polygon-shaped structures are separated from the sacrificial layer. With the proper choice of growth substrate material, the annealing can be performed at a relatively high temperature.Type: GrantFiled: June 2, 2016Date of Patent: September 4, 2018Assignee: eLux Inc.Inventors: Mark Albert Crowder, Changqing Zhan, Karen Nishimura, Paul Schuele
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Patent number: 10032957Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.Type: GrantFiled: August 21, 2017Date of Patent: July 24, 2018Assignee: eLux Inc.Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
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Patent number: 9985190Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to diodes offering orientation control properties in a fluidic assembly system.Type: GrantFiled: May 18, 2016Date of Patent: May 29, 2018Assignee: eLux Inc.Inventors: Changqing Zhan, Mark Albert Crowder, Paul John Schuele
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Publication number: 20180144957Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.Type: ApplicationFiled: January 1, 2018Publication date: May 24, 2018Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer