Abstract: A GmAPD FPA having increased tolerance optical overstress includes a limit resistor that is monolithically integrated into each pixel in the FPA, and which limits the magnitude of the current entering the read out integrated circuit.

Abstract: A GmAPD FPA having increased tolerance optical overstress includes a limit resistor that is monolithically integrated into each pixel in the FPA, and which limits the magnitude of the current entering the read out integrated circuit.

Abstract: An image sensing device including a Geiger-mode avalanche photodiode (GmAPD), a read out integrated circuit (ROIC), and a limit resistor connected to the GmAPD and the ROIC in series, wherein the ROIC includes an active quenching circuit.

Abstract: Disclosed herein are system, method, and computer program product embodiments for adjusting a transmission field-of-view (Tx FoV). For example, the system includes a lidar sensor with a series of emitters. Each emitter is configured to transmit light pulses away from a vehicle along a transmission axis to form a transmission field-of-view (Tx FoV). At least one detector is configured to receive at least a portion of the light pulses that reflect off of an object within a reception field-of-view (Rx FoV) along a reception axis. A transmit optic is mounted for translation along a transverse axis and configured to intersect each transmission axis without intersecting the reception axis to adjust the Tx FoV without adjusting the Rx FoV.

Abstract: A GmAPD FPA having increased tolerance optical overstress includes a limit resistor that is monolithically integrated into each pixel in the FPA, and which limits the magnitude of the current entering the read out integrated circuit.

Abstract: Disclosed herein are system and method embodiments for generating a signal indicative of light received by a lidar unit that has a high signal-to-noise ratio. For example, the system includes a focal plane assembly (FPA) with an array of detectors. The FPA includes a micro-lens array (MLA) with an input surface that is configured to receive light, and an array of optics forming an output surface arranged along a focal plane that is configured to focus the light on the array of detectors. A mask is disposed over an outer portion of at least one of the input surface and the output surface. The mask is configured to absorb stray light and reduce optical noise within the MLA.

Abstract: A GmAPD FPA having increased tolerance optical overstress includes a limit resistor that is monolithically integrated into each pixel in the FPA, and which limits the magnitude of the current entering the read out integrated circuit.

Abstract: A GmAPD FPA having increased tolerance optical overstress includes a limit resistor that is monolithically integrated into each pixel in the FPA, and which limits the magnitude of the current entering the read out integrated circuit.

Abstract: A GmAPD FPA having increased tolerance optical overstress includes a limit resistor that is monolithically integrated into each pixel in the FPA, and which limits the magnitude of the current entering the read out integrated circuit.

Abstract: An avalanche photodiode (APD) array with reduced cross talk comprises, in the illustrative embodiment, a 2D array of Geiger-mode APDs, wherein a via is formed partially through the backside (substrate) of each APD in the array, wherein the via is offset from the active region of each said APD.

Abstract: A GmAPD FPA having increased tolerance optical overstress includes a limit resistor that is monolithically integrated into each pixel in the FPA, and which limits the magnitude of the current entering the read out integrated circuit.

Abstract: An avalanche photodiode (APD) array with reduced cross talk comprises, in the illustrative embodiment, a 2D array of Geiger-mode APDs, wherein a via is formed through the backside (substrate) of each APD in the array.

Abstract: An avalanche photodiode (APD) array with reduced cross talk comprises, in the illustrative embodiment, a 2D array of Geiger-mode APDs, wherein a via is formed partially through the backside (substrate) of each APD in the array, wherein the via is offset from the active region of each said APD.

Abstract: A scalable fuse design for individual pixels of a focal plane array of photodiodes comprises a fuse disposed on the upper surface of each photodiode in the array, wherein the fuse is situated proximal to a side of each photodiode. The fuse of each photodiode is electrically coupled to the active region thereof via a first bus and is electrically coupled to an ROIC via a second bus.

Abstract: A scalable fuse design for individual pixels of a focal plane array of photodiodes comprises a fuse disposed on the upper surface of each photodiode in the array, wherein the fuse is situated proximal to a side of each photodiode. The fuse of each photodiode is electrically coupled to the active region thereof via a first bus and is electrically coupled to an ROIC via a second bus.

Abstract: An avalanche photodiode (APD) array with reduced cross talk comprises, in the illustrative embodiment, a 2D array of Geiger-mode APDs, wherein a via is formed through the backside (substrate) of each APD in the array.

Abstract: A method for computing the intensity of light incident on a photodiode capable detecting single photons comprises using arrival-time statistics for a plurality of detected single photons. The statistics are based on the determination of the arrival time for each detected photon relative to the beginning of a detection period within an image frame in which the photon is detected. In some embodiments, Poisson statistics are applied to the computation of the intensity. By computing the intensity of light in this manner for each of plurality of single-photon photodetectors that compose a focal plane array, a high-contrast image of a scene can be developed.

Abstract: A negative feedback avalanche diode for detecting the receipt of a single photon is described. The photodetector comprises a load element having two load states, one characterized by high impedance and the other characterized by low impedance. The load state of the load element is controlled by a control signal generated within the negative feedback avalanche diode itself.

Abstract: A single-photon receiver is presented. The receiver comprises two SPADs that are monolithically integrated on the same semiconductor chip. Each SPAD is biased with a substantially identical gating signal. The output signals of the SPADs are combined such that capacitive transients present on each output signal cancel to substantially remove them from the output signal from the receiver.

Abstract: Methods for forming a buried p-n junction and avalanche photodiodes incorporating same are disclosed. The method includes forming a well in a semiconductor layer, wherein a depth of the well is selected as a function of the desired shape of the p-n junction in the edge region of the avalanche photodiode. A diffusion mask is then formed on the semiconductor layer, wherein the diffusion mask includes at least two openings per APD formed, wherein one opening is a diffusion window and the other is a diffusion sink. The depth of the p-n junction in the active region of the APD is based, in part, on an attribute of the diffusion mask relating to the diffusion sink.