Abstract: A customizeable interconnect device is provided for coupling a base component to a stacked insert component. The interconnect device is customizeable to provide connection between various types of components, regardless of whether the components are leaded or leadless, or whether the lead pitch is large or small. The interconnect device is fully customized by modifying a retainer, a base and/or a housing. Each part (i.e., base, retainer and housing) is coupled together as a modular assembly, wherein the base is customizeable to fit the lead arrangement of the base component, and the retainer is customizeable to fit the lead arrangement of a daughter board edge connector. One or more daughter boards are inserted into corresponding housing units in stacked, spaced arrangement over a base component to enhance interconnect density in a three-dimensional fashion.