Abstract: Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including a stiffener member with a via. In various embodiments, an apparatus includes a substrate and a connector electrically coupled to the substrate. A stiffener member is disposed between the substrate and the connector and configured to restrain at least one of the substrate or the connector. A via extends through a body of the stiffener member and electrically couples the connector to the substrate.