Abstract: A compact laser package having a submount with a plurality of electrical contact pads and a plurality of electrical connection lines formed thereon. The submount may be configured to receive at least one optical component thereon, the at least one optical component being in electrical communication with at least one of the plurality of electrical connection lines. A lid is provided, the lid having a recessed portion and a groove formed therein, the recessed portion being positioned in an interior of the lid and the groove being positioned to intersect the recessed portion and a peripheral edge of the lid. The submount is generally configured to cooperatively engage the lid to form a hermetically sealed laser package.

Abstract: A compact laser package having a submount with a plurality of electrical contact pads and a plurality of electrical connection lines formed thereon. The submount may be configured to receive at least one optical component thereon, the at least one optical component being in electrical communication with at least one of the plurality of electrical connection lines. A lid is provided, the lid having a recessed portion and a groove formed therein, the recessed portion being positioned in an interior of the lid and the groove being positioned to intersect the recessed portion and a peripheral edge of the lid. The submount is generally configured to cooperatively engage the lid to form a hermetically sealed laser package.

Abstract: The specification describes thermo-optically controlled waveguides where the thermo-optic control is a heater strip precisely aligned to the waveguide core by using the heater strip as an etch mask to define at least part of the core/upper cladding structure. In one embodiment the heater strip mask is larger than the underlying waveguide core so as to produce, on etching, a core surrounded with a minimum of cladding material on the sidewalls of the core, and a confined heat channel between the waveguide core and the heater strip. In a second embodiment the heater strip is used as an etch mask to define a core cladding stack, and a third cladding layer is deposited to clad the sidewalls of the core. In this embodiment, the cladding material in the stack can be optimized for thermal conductivity, and the third cladding material can be optimized for thermo-optic sensitivity.

Abstract: The specification describes wafer fabrication cleaning processes for silicon optical bench technology. The cleaning processes are designed to remove debris in situ after dicing silicon wafers mounted on a tape carrier. They were also developed specifically to avoid staining and residues that often result from using standard dicing approaches in silicon optical bench integrated circuit manufacture.

Abstract: In accordance with a specific deposition/etching sequence, a multi-layer metallization system is formed on the non-planar top surface of a semiconductor wafer. In an electrophoretic deposition step, a conformal uniform-thickness layer of a resist material is then formed on the top surface of the metallization system. In turn, the layer of resist material is lithographically patterned to provide an etch-mask for defining features in the underlying metallization system.