Abstract: Light fixtures for illuminating spaces that use light emitting diode-based light sources and that incorporate chip on board technology that enables the light emitting diode to be mounted directly on a portion of the light fixture. In some embodiments, the light fixture includes a reflector assembly onto which the light emitting diode is directly mounted. In other embodiments, the reflector assembly includes an aperture that receives a board having chip on board technology onto which the light emitting diode is directly mounted. In some embodiments, the light fixture also includes a diffuser for diffusing the light emanating from the light emitting diodes.

Abstract: A single board light engine includes an AC to AC step driver that selectively powers multiple LED segments by controlling tap points between the LED segments as the input voltage goes from zero crossover to maximum voltage and returns to zero crossover. The step driver may power a first LED segment, a second LED segment, both the first and second LED segments, or none of the LED segments depending upon the input voltage level. The LEDs within an LED segment may share a characteristic that differs from a characteristic shared by LEDs in another segment, which allows the LED fixture to provide a variety of lighting effects.

Abstract: A single board light engine includes an AC to AC step driver that selectively powers multiple LED segments by controlling tap points between the LED segments as the input voltage goes from zero crossover to maximum voltage and returns to zero crossover. The step driver may power a first LED segment, a second LED segment, both the first and second LED segments, or none of the LED segments depending upon the input voltage level. The LEDs within an LED segment may share a characteristic that differs from a characteristic shared by LEDs in another segment, which allows the LED fixture to provide a variety of lighting effects.

Abstract: A single board light engine includes an AC to AC step driver that selectively powers multiple LED segments by controlling tap points between the LED segments as the input voltage goes from zero crossover to maximum voltage and returns to zero crossover. The step driver may power a first LED segment, a second LED segment, both the first and second LED segments, or none of the LED segments depending upon the input voltage level. The LEDs within an LED segment may share a characteristic that differs from a characteristic shared by LEDs in another segment, which allows the LED fixture to provide a variety of lighting effects.

Abstract: A lighting assembly includes a light source and a lens. The lens includes a light transmissive portion and an optic shield portion for blocking or redirecting at least a portion of light generated by the light source. The light source can include one or more light emitting diodes (LEDs). The optic shield can be painted on or otherwise applied to a portion of the lens. Alternatively, it can be integrally formed with the lens. The optic shield can be an opaque material for blocking light generated by the light source or can be a reflective material for reflecting light generated by the light source through the light transmissive portion of the lens. Methods for making an optic shield are also described.

Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.

Abstract: A lighting assembly includes a light source and a lens. The lens includes a light transmissive portion and an optic shield portion for blocking or redirecting at least a portion of light generated by the light source. The light source can include one or more light emitting diodes (LEDs). The optic shield can be painted on or otherwise applied to a portion of the lens. Alternatively, it can be integrally formed with the lens. The optic shield can be an opaque material for blocking light generated by the light source or can be a reflective material for reflecting light generated by the light source through the light transmissive portion of the lens. Methods for making an optic shield are also described.

Abstract: Light fixtures including at least an enclosure, a heat sink, and a light-emitting diode. In one embodiment the heat sink has a first portion having fins (that protrudes outside of the enclosure) and a second portion to house and mount the LEDs (that is positioned within the enclosure). Certain embodiments also provide for gaskets and other structure to prevent leakage between the heat sink and the enclosure, such that the light fixture is water-resistant.

Abstract: A single board light engine includes an AC to AC step driver that selectively powers multiple LED segments by controlling tap points between the LED segments as the input voltage goes from zero crossover to maximum voltage and returns to zero crossover. The step driver may power a first LED segment, a second LED segment, both the first and second LED segments, or none of the LED segments depending upon the input voltage level. The LEDs within an LED segment may share a characteristic that differs from a characteristic shared by LEDs in another segment, which allows the LED fixture to provide a variety of lighting effects.

Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.

Abstract: In a lighting apparatus, comprising a heatsink having at one side thereof a recess with at least one groove extending over the length of the heatsink, a plurality of lighting units are arranged in the groove or grooves oriented toward the opening of the recess for the emission of light therefrom and the frame is provided at the side opposite the opening with heatsink ribs, the lighting units in the groove or grooves being encapsulated by an encapsulating material added into the groove or grooves and being cured therein so as to be in direct contact with the groove walls and enclosing the lighting units at least up to the light emitting lenses thereof.

Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.

Abstract: An LED module or assembly is disclosed, the assembly having at least one LED component mounted on a support or circuit board and an optical element which encloses the at least one LED component and defines an interior space in which the at least one LED component is housed. A vent device is defined within the optical element for permitting gases generated from operation of the at least one LED component to be vented to atmosphere. The vent device prevents outside moisture from entering the interior space, but permits the gases to pass out to atmosphere for minimizing the likelihood of fogging of the optical elements in the interior space of the assembly.

Abstract: Light fixtures including at least an enclosure, a heat sink, and a light-emitting diode. In one embodiment the heat sink has a first portion having fins (that protrudes outside of the enclosure) and a second portion to house and mount the LEDs (that is positioned within the enclosure). Certain embodiments also provide for gaskets and other structure to prevent leakage between the heat sink and the enclosure, such that the light fixture is water-resistant. Thus, embodiments of the light fixture may house LEDs and related electric components inside a water-resistant enclosure and cool those components by transferring thermal energy to the surrounding air.

Abstract: In a light emitting diode arrangement for lighting purposes, comprising a circuit board with at least one light generating semiconductor element disposed on the circuit board and conductors extending on the circuit board to the semiconductor element and being electrically connected to terminals of the semiconductor element, a light transmissive element is disposed on the circuit board and covers the semiconductor element and a flame resistant cover element is disposed below the light transmissive element and on top of the terminals to cover the terminals to provide for electrical and flame insulation thereof.

Abstract: Light fixtures for illuminating spaces that use light emitting diode-based light sources and that incorporate chip on board technology that enables the light emitting diode to be mounted directly on a portion of the light fixture. In some embodiments, the light fixture includes a reflector assembly onto which the light emitting diode is directly mounted. In other embodiments, the reflector assembly includes an aperture that receives a board having chip on board technology onto which the light emitting diode is directly mounted. In some embodiments, the light fixture also includes a diffuser for diffusing the light emanating from the light emitting diodes.

Abstract: Display cases having lighting assemblies and methods of illuminating display cases with such lighting assemblies. Embodiments of the lighting assemblies may be used in display cases of any type and particularly in those where the purchaser selects via an external mechanism (e.g., buttons) a product from a variety of products stored inside the display, such as a vending machine. Lighting assemblies are installed within a vending machine, such as on or within the vending machine shelves or product dividers, and their light emission controlled depending on the product being selected from the vending machine. In on embodiment, all light sources within the vending machine except those illuminating the selected product are dimmed. In this way, the product being selected by the purchaser can be emphasized. In other embodiments, color or multi-color LEDs are used to emit light that best compliments the color of products housed within the vending machine.

Abstract: A lighting assembly includes a light source and a lens. The lens includes a light transmissive portion and an optic shield portion for blocking or redirecting at least a portion of light generated by the light source. The light source can include one or more light emitting diodes (LEDs). The optic shield can be painted on or otherwise applied to a portion of the lens. Alternatively, it can be integrally formed with the lens. The optic shield can be an opaque material for blocking light generated by the light source or can be a reflective material for reflecting light generated by the light source through the light transmissive portion of the lens. Methods for making an optic shield are also described.

Abstract: An LED module or assembly is disclosed, the assembly having at least one LED component mounted on a support or circuit board and an optical element which encloses the at least one LED component and defines an interior space in which the at least one LED component is housed. A vent device is defined within the optical element for permitting gases generated from operation of the at least one LED component to be vented to atmosphere. The vent device prevents outside moisture from entering the interior space, but permits the gases to pass out to atmosphere for minimizing the likelihood of fogging of the optical elements in the interior space of the assembly.