Patents by Inventor Mark Anthony Takacs

Mark Anthony Takacs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate
    Patent number: 6596621
    Abstract: A method of forming a lead-free solder alloy on an electronic substrate. In the method, a metal stack which includes a thick nickel barrier layer and an outer copper layer is then evaporated or plated with silver and tin. Upon heating to an appropriate temperature, the copper, tin and silver form a lead-free tin, silver, copper solder.
    Type: Grant
    Filed: May 17, 2002
    Date of Patent: July 22, 2003
    Assignee: International Business Machines Corporation
    Inventors: Bruce Anthony Copeland, Rebecca Yung Gorrell, Mark Anthony Takacs, Kenneth J. Travis, Jr., Jun Wang, Lovell B. Wiggins