Abstract: Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

Abstract: A method of forming a TMDC monolayer comprises providing a multi-layer transition metal dichalcogenide (TMDC) film. The multi-layer TMDC film comprises a plurality of layers of the TMDC. The multi-layer TMDC film is positioned on a conducting substrate. The conducting substrate is contacted with an electrolyte solution. A predetermined electrode potential is applied on the conducting substrate and the TMDC monolayer for a predetermined time. A portion of the plurality of layers of the TMDC included in the multi-layer TMDC film is removed by application of the predetermined electrode potential, thereby leaving a TMDC monolayer film positioned on the conducting substrate.

Abstract: A method of forming a TMDC monolayer comprises providing a multi-layer transition metal dichalcogenide (TMDC) film. The multi-layer TMDC film comprises a plurality of layers of the TMDC. The multi-layer TMDC film is positioned on a conducting substrate. The conducting substrate is contacted with an electrolyte solution. A predetermined electrode potential is applied on the conducting substrate and the TMDC monolayer for a predetermined time. A portion of the plurality of layers of the TMDC included in the multi-layer TMDC film is removed by application of the predetermined electrode potential, thereby leaving a TMDC monolayer film positioned on the conducting substrate.

Abstract: A backscratcher having a telescopically adjustable shaft and a plurality of interchangeable attachment end pieces. The shaft has a plurality of segments which may be telescopically positioned within one another, in order to maximally extend the shaft, or alternately, to retract the shaft into a storage position. The shaft terminates at one end with an attachment segment having a threaded bore, thereby allowing selective attachment to corresponding threads located upon the attachment end pieces. The shaft terminates at its other end with an outermost segment having a clip on its outside surface, thereby allowing selective attachment of the backscratcher to a pocket on an item of clothing worn by a user. The interchangeable attachment end pieces include two backscratchers, a mirror, a pen, a fork, a spoon, a hand pointer, a business card holder, a toothbrush, a Phillips screwdriver, a magnet, an alligator clip, and a multiple attachment end piece.

Abstract: A method for splicing broken ends of wires suspended from a given height by attaching belts extending from opposite ends of a device to points near the broken ends, operating the device in one direction to draw the broken ends together and raise the device near to said given level, splicing the broken ends of said wires, operating the device in the reverse direction, and detaching the belts from said wires.