Patents by Inventor Mark Arnold Delsman

Mark Arnold Delsman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ribbon bonding tool and process
    Patent number: 7934633
    Abstract: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 ?m or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 ?m. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: May 3, 2011
    Assignee: Orthodyne Electronics Corporation
    Inventors: Mark Arnold Delsman, Christoph Benno Luechinger
  • Ribbon bonding tool and process
    Patent number: 7909228
    Abstract: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 ?m or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 ?m. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: March 22, 2011
    Assignee: Orthodyne Electronics Corporation
    Inventors: Mark Arnold Delsman, Christoph Benno Luechinger
  • Ribbon bonding tool and process
    Patent number: 7838101
    Abstract: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 ?m or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 ?m. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: November 23, 2010
    Assignee: Orthodyne Electronics, Inc.
    Inventors: Mark Arnold Delsman, Christoph Benno Luechinger
  • RIBBON BONDING TOOL AND PROCESS
    Publication number: 20090297786
    Abstract: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 ?m or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 ?m. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
    Type: Application
    Filed: August 5, 2009
    Publication date: December 3, 2009
    Applicant: Orthodyne Electronics Corporation
    Inventors: Mark Arnold Delsman, Christoph Benno Luechinger
  • RIBBON BONDING TOOL AND PROCESS
    Publication number: 20080190993
    Abstract: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 ?m or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 ?m. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
    Type: Application
    Filed: April 15, 2008
    Publication date: August 14, 2008
    Applicant: Orthodyne Electronics Corporation
    Inventors: Mark Arnold Delsman, Christoph Benno Luechinger
  • RIBBON BONDING TOOL AND PROCESS
    Publication number: 20080193719
    Abstract: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 ?m or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 ?m. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
    Type: Application
    Filed: April 15, 2008
    Publication date: August 14, 2008
    Applicant: Orthodyne Electronics Corporation
    Inventors: Mark Arnold Delsman, Christoph Benno Luechinger