Abstract: A heatsink for dissipating heat from electronic components, such as integrated circuits, on a circuit board. The heatsink is formed from metal foil and comprises a series of coplanar base portions interposed with transverse fins. The heatsink can be constructed from a length of metal foil which is folded to form the base portions and transverse fins. A base layer comprising, for example, an additional strip of sheet metal material, has adhesive on both sides and is affixed to the base portions of the folded foil on one side and the surface of the electronic component using the adhesive on the other side. The foil or sheet material forming the base portions, fins and base layer of the heatsink are relatively thin and flexible such that lengths of the heatsink can be manufactured and coiled into rolls for transportation and storage. A portion of the heatsink can then be cut to length from the roll thereof and applied to a row of a plurality of components.