Abstract: Airflow patterns from fans and centrifugal blowers that force air into cardcages may be very irregular and unpredictable. Because the amount of cooling provided by fans and centrifugal blowers is based directly upon the velocity of air over the components of the circuit cards within the cardcages, irregular airflow patterns may lead to unreliable operation of circuit cards due to inadequate cooling. In a broad aspect, the present invention comprises a system for controlling the temperatures of circuit cards in cardcages or other enclosures by controlling the flow of air. More particularly, the invention comprises mechanical flow diverters which may divert, deflect, channel or otherwise re-distribute the flow of air to attain a generally common or consistent rate of flow past each circuit card in a cardcage. The invention may be assembled as a discrete part and attached either to the fan, cardcage or other support structure or the invention can be an integral part of the cardcage.

Abstract: A hermetic connector for use with a closed compartment includes a connector body having a mounting plate that overlaps an opening in the closed compartment. Electrical or optical connections are made between the internal and external sides of the compartment by a pair of mating connectors each having a contact area. The contact area includes a plurality of single piece pins or a socket connecting to similar pins of the mating connector. The hermetic connector further includes an o-ring seal surrounding one of the connectors and squeezed between the connector body and the interior side of the closed compartment. A plurality of mounting screws extend through mounting holes of the connector body for attachment of the connector to the closed compartment.

Abstract: A spray cooled enclosure and method for obtaining a substantially improved operating environment for at least one electronic component/card located within the enclosure. The spray cooled enclosure includes a closed compartment that isolates the electronic components/cards from the environment. A dielectric heat transfer fluid stored within the closed compartment is distributed by a spraying system such that a thin-film layer of the heat transfer fluid is continually formed over a substantial portion of the surfaces of the electronic components/cards resulting in a substantially reduced thermal gradient across the electronic components/cards. Also included is a closed-loop condensing system for condensing the heat transfer fluid vaporized in response to heat transferred from the electronic components/cards to the layer of heat transfer fluid.

Abstract: A tapered thermal substrate for transferring heat generated from a heat source to a heat sink comprising a composite core of parallel layers of thermally conductive fibers, the core having a tapered edge that maximizes fiber end exposure to the heat source or sink. The tapered edge is comprised of at least one angled surface formed by machining the composite core. A copper thermal tab is plated to each angled surface and machined to a desired size and shape to provide a contact surface for the heat source or sink and a means for facilitating transfer of generated heat to and from the fiber ends. A flashing of a thin coating of copper and nickel over the composite core and each copper thermal tab is also provided to environmentally seal the composite core.