Abstract: Embodiments include curable compositions including an epoxy resin and a hardener component including a polymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 0.5:1 to 5:1. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.

Abstract: Curable compositions comprising an epoxy mixture comprising a) an epoxy mixture comprising i) a first epoxy component comprising epoxy phenol novolac oligomers having a content of 2-functional monomers of less than 10 weight percent based on the total weight of the first epoxy component and having an epoxide equivalent weight in the range of 170 to 200; and ii) a second epoxy component comprising an epoxy resin having monomers with an average functionality of at least 2 and b) a hardener, are disclosed. The curable compositions can be used to prepare prepregs for hot-melt applications.

Abstract: Curable compositions comprising an epoxy mixture comprising a) an epoxy mixture comprising i) a first epoxy component comprising epoxy phenol novolac oligomers having a content of 2-functional monomers of less than 10 weight percent based on the total weight of the first epoxy component and having an epoxide equivalent weight in the range of 170 to 200; and ii) a second epoxy component comprising an epoxy resin having monomers with an average functionality of at least 2 and b) a hardener, are disclosed. The curable compositions can be used to prepare prepregs for hot-melt applications.

Abstract: Embodiments include curable compositions including an epoxy resin and a hardener component including a polymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 0.5:1 to 5:1. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.

Abstract: Embodiments of the present disclosure provide a composition that includes a phosphorous-containing compound, a cyanate ester, an epoxy resin, and a maleimide. For the various embodiments, a viscosity of the composition increases less than 100% as measured by Gardner Bubble Viscosity a temperature of 23° C. in at least 3 days. For the various embodiments, the composition of the present disclosure can also include an aprotic solvent, such as a ketone. Embodiments of the present disclosure further include a composition that includes the phosphorous-containing compound, the cyanate ester, and the aprotic solvent. For the various embodiments, the composition can also include the epoxy resin and the maleimide. For the various embodiments, the composition does not include an aliphatic alcohol.

Abstract: An adduct of (a) at least one divinylarene dioxide, and (b) at least one end-functionalized polymer. For example, the adduct may be beneficially used as a toughening agent for toughening thermoset resins such as epoxy resins.

Abstract: A composition comprising a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof, and wherein said composition contains a non-halogen flame retardant is disclosed.

Abstract: Aromatic dicyanate compounds which comprise aliphatic moieties having at least about six carbon atoms and resins and thermoset products based on these compounds.

Abstract: A masterblend comprising a solvent and a core shell rubber which is formed by dispersing a core shell rubber in the solvent in a dispersion zone is disclosed. The masterblend can then be admixed with a thermosetting resin to form a curable composition.

Abstract: Aromatic dicyanate compounds which comprise aliphatic moieties having at least about six carbon atoms and resins and thermoset products based on these compounds.

Abstract: A curable epoxy resin composition including (a) at least one epoxy resin; and (b) at least one hardener; wherein the curable epoxy resin composition has at least two exotherm peaks representing at least two distinct chemical reactions and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable epoxy resin composition of being B-staged.

Abstract: A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged.

Abstract: Aromatic dicyanate compounds which comprise aliphatic moieties having at least about six carbon atoms and resins and thermoset products based on these compounds.

Abstract: A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers.

Abstract: A multifunctional aromatic amine hardener composition including the reaction condensation product of (a) at least one aniline and (b) at least one non-aromatic cyclic dicarboxaldehyde; and a reactive thermosettable resin composition including (i) at least one multifunctional aromatic amine hardener composition curing agent, (ii) at least one thermoset resin, and optionally (c) at least one catalyst; and a process for preparing a thermoset product from the thermosettable composition. The hardener composition above and a thermoset resin may be used to prepare a thermoset product with improved thermo-mechanical behavior.

Abstract: A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged.

Abstract: A curable epoxy resin composition including (a) at least one epoxy resin; and (b) at least one hardener; wherein the curable epoxy resin composition has at least two exotherm peaks representing at least two distinct chemical reactions and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable epoxy resin composition of being B-staged.

Abstract: Aromatic polycyanate compounds which comprise cycloaliphatic moieties, a process for the production thereof and resins and thermoset products which are based on these compounds.

Abstract: A thermosetting monomer comprising at least two of an aryl-cyanato group and at least two of a phosphorus group.

Abstract: A composition comprising, consisting of, or consisting essentially of: a) tetraphenolic epoxy resin; b) a maleimide; and c) a triazine and/or a cyanate ester is disclosed. Also disclosed is a process for making the composition and its end-uses, such as in electrical laminates and composites.