Patents by Inventor Mark Beesley

Mark Beesley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170083042
    Abstract: This application relates to systems, methods, and apparatuses for reducing bending stresses and tension from damaging components of a computing device. A component of the computing device can be connected to a spacer that can distribute impact forces and resist bending when an impact force is applied to the computing device. Additionally, a bracket can be connected to a circuit board of the computing device to further help distribute impact forces and resist bending. The bracket can be ring shaped and surround components connected to the circuit board to intercept impact forces from contacting the components.
    Type: Application
    Filed: September 21, 2015
    Publication date: March 23, 2017
    Inventors: Shawn X. ARNOLD, G. Kyle LOBISSER, Mark BEESLEY
  • Publication number: 20140307403
    Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
    Type: Application
    Filed: June 25, 2014
    Publication date: October 16, 2014
    Inventors: Günther Weichslberger, Arno Kriechbaum, Mike Morianz, Nikolai Haslebner, Johannes Stahr, Fritz Haring, Gerhard Freydl, Andrea Koertvelyessy, Mark Beesley, Andreas Zluc, Wolfgang Schrittwieser
  • Patent number: 8789271
    Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: July 29, 2014
    Assignee: AT & S Austria Technologies & Systemtechnik Aktiengesellschaft
    Inventors: Günther Weichslberger, Arno Kriechbaum, Mike Morianz, Nikolai Haslebner, Johannes Stahr, Fritz Haring, Gerhard Freydl, Andrea Koertvelyessy, Mark Beesley, Andreas Zluc, Wolfgang Schrittwieser
  • Publication number: 20110069448
    Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
    Type: Application
    Filed: May 29, 2009
    Publication date: March 24, 2011
    Inventors: Günther Weichslberger, Arno Kriechbaum, Mike Morianz, Nikolai Haslebner, Johannes Stahr, Fritz Haring, Gerhard Freydl, Andrea Koertvelyessy, Mark Beesley, Andreas Zluc, Wolfgang Schrittwieser