Patents by Inventor Mark Berelowitz

Mark Berelowitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF ENCAPSULATION OF A FLEXIBLE COMPONENT
    Publication number: 20110266713
    Abstract: A method of encapsulation of a flexible component having a preferred shape and dimensions including a void within the flexible component is disclosed. The method includes at least partially encapsulating the flexible component in a first mould using a curable material which shrinks in volume as it cures distorting the flexible component. The method includes an additional step of at least partially encapsulating the flexible component in a second mould using a curable material at a pressure so as to at least fill and expand unoccupied volume of the void such that the flexible component substantially conforms to the preferred shape and preferred dimensions of the flexible component. The flexible component may be of shape memory material.
    Type: Application
    Filed: December 18, 2009
    Publication date: November 3, 2011
    Inventors: Graeme Vincent, Mark Berelowitz, Milind Raje