Patents by Inventor Mark Bergman

Mark Bergman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250282524
    Abstract: A vessel includes a container, a bracket, and a brace. The container has a cavity. The bracket extends from the container and includes an arm spaced from the container. The arm has opposed first and second ends, and the arm is connected to the container only at its first end. The brace connects the first end of the arm and the container. A first plurality of structural reinforcement flanges extend along the container between the brace and the second end of the arm. The first plurality of structural reinforcement flanges have curved exterior surfaces.
    Type: Application
    Filed: May 23, 2025
    Publication date: September 11, 2025
    Inventors: Jeffrey Given, Mark Bergman, Jeffrey Waffensmith, Matthew Leyden
  • Patent number: 12338033
    Abstract: A vessel includes a container, a bracket, a bail and a grip. The container has a cavity configured to hold a liquid. The bracket extends from the container and comprises an arm spaced from the container. The arm has opposed first and second ends, and the arm is connected to the container only at its first end. The bail is pivotally connected to the container and has a grip thereon. The vessel is configured so that the grip has a position that is in contact with the arm, thereby defining, in combination, a composite vessel handle. A method of supporting a vessel includes pivoting the bail so that the grip is in contact with the arm and positioning at least a portion of a hand on the grip.
    Type: Grant
    Filed: February 14, 2023
    Date of Patent: June 24, 2025
    Assignee: BERCOM INTERNATIONAL, LLC
    Inventors: Jeffrey Given, Mark Bergman, Jeffrey Waffensmith, Matthew Leyden
  • Publication number: 20230264860
    Abstract: A vessel includes a container, a bracket, a bail and a grip. The container has a cavity configured to hold a liquid. The bracket extends from the container and comprises an arm spaced from the container. The arm has opposed first and second ends, and the arm is connected to the container only at its first end. The bail is pivotally connected to the container and has a grip thereon. The vessel is configured so that the grip has a position that is in contact with the arm, thereby defining, in combination, a composite vessel handle. A method of supporting a vessel includes pivoting the bail so that the grip is in contact with the arm and positioning at least a portion of a hand on the grip.
    Type: Application
    Filed: February 14, 2023
    Publication date: August 24, 2023
    Inventors: Jeff Given, Mark Bergman, Jeff Waffensmith, Matt Leyden
  • Patent number: 10881001
    Abstract: An interconnect component is configured as an adapter or interposer providing mechanical and electrical interconnects between conductive threads, such as those woven within fabrics, and electrical connection points, such as contact pads on a printed circuit board (PCB), a flexible printed circuit (FPC), and/or a rigid-flex circuit board.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: December 29, 2020
    Assignee: Flex Ltd.
    Inventors: Mark Bergman, Yolita Nugent
  • Patent number: 10757800
    Abstract: A circuit board transmission line structures has microstrip or stripline transmission line geometries and cross-hatch patterned return planes. The cross-hatch design structure of the return planes and the relative position of the cross-hatch pattern to the transmission lines are configured to increase the usable bandwidth of the transmission lines. By properly adjusting the size and shape of the cross-hatch pattern, the performance of the microstrip and stripline transmission lines can be largely restored to the performance where continuous, solid return planes are used.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: August 25, 2020
    Assignee: Flex Ltd.
    Inventors: Mark Bergman, Franz Gisin
  • Patent number: 10154583
    Abstract: A mechanical strain reduction system include a flexible circuit section of a printed circuit board configured with a meandering shape while in a static state, and a compressible material having a cavity such that the meandering flexible circuit section is positioned within the cavity while the flexible circuit section is in the static state. The flexible circuit section can be part of a rigid-flexible printed circuit board or a flexible printed circuit board. The cavity can be shaped with the same meandering shape as the flexible circuit section in the static state. In general, the cavity is sufficiently shaped to allow positioning of the meandering flexible circuit section within the cavity. Support structures of the same, or different, compressible material can be interspersed within the meander of the flexible circuit section.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: December 11, 2018
    Assignee: Flex Ltd
    Inventors: Michael James Glickman, Mark Bergman, Joan Vrtis
  • Patent number: 10123603
    Abstract: The luggage lighting system includes a piece of luggage and a lighting module coupled to the luggage. In some embodiments, the lighting module is a fiber-optic lighting module. The luggage includes an outer surface, and the lighting module includes a light diffuser coupled to the outer surface. In some embodiments, the light diffuser is a fiber-optic light diffuser. The lighting module also includes a light source, such as a laser or a light emitting diode (LED). When the light source is powered on, the output light is directed through the light diffuser. The light diffuser is configured to output single or multiple colors of light, easily observed by someone looking at the luggage. The luggage lighting system is particularly useful for identifying one's luggage from surrounding pieces of luggage lacking the luggage lighting system.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: November 13, 2018
    Assignee: Multek Technologies Limited
    Inventors: Michael James Glickman, Mark Bergman, Joan Vrtis
  • Publication number: 20180255639
    Abstract: An interconnect component is configured as an adapter or interposer providing mechanical and electrical interconnects between conductive threads, such as those woven within fabrics, and electrical connection points, such as contact pads on a printed circuit board (PCB), a flexible printed circuit (FPC), and/or a rigid-flex circuit board.
    Type: Application
    Filed: March 2, 2018
    Publication date: September 6, 2018
    Inventors: Mark Bergman, Yolita Nugent
  • Patent number: 10015880
    Abstract: A rip stop material is attached at a stress area of a flexible circuit board in order to strengthen the flexible circuit board and minimize ripping and cracking in the polyimide and/or the copper conductors of the circuit. A rip stop transition layer is formed and deposited at a location on the flexible circuit in order to minimize, reduce, if not preventing cracking and ripping of the circuit as it is bent and flexed. The rip stop transition layer can be placed at different locations on and within the flexible circuit in order to minimize cracking and ripping as the flexible circuit is bent, flexed and twisted.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: July 3, 2018
    Assignee: Multek Technologies Ltd.
    Inventors: Mark Bergman, Joan K. Vrtis
  • Patent number: 9936581
    Abstract: An electrically interconnected assembly is a technology enabler for mechanical and electrical interconnects between conductive threads, such as those within fabrics and textiles, to electrical connection points, such as contact pads on a printed circuit board (PCB), a flexible printed circuit (FPC), and/or rigid-flexible circuit board. The electrically interconnected assembly uses an anisotropic conductive coated fabric to make an electrical and mechanical interconnect in fabrics or textiles. All fabrics or textiles can be anisotropic conductive coated and cut into sheet form or supplied in roll form.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: April 3, 2018
    Assignee: Flex Ltd.
    Inventor: Mark Bergman
  • Patent number: 9736947
    Abstract: A process of constructing a filled via of a printed circuit board comprises drilling a via hole through a body of the printed circuit board, desmearing a barrel of the via hole, metallizing a outer surface of the via barrel, electroplating the via barrel, pushing nano-copper solder into the via hole and heating the circuit board in order to melt the nano-copper solder within the via hole. The nano-copper solder improves the thermal conductivity of the printed circuit board for applications when heat needs to be conducted from one side of the printed circuit board to another.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: August 15, 2017
    Assignee: Multek Technologies, Ltd.
    Inventors: Mark Bergman, Joan K. Vrtis, Michael James Glickman
  • Patent number: 9723713
    Abstract: In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, a flexible section of the printed circuit board is configured to have a non-linear portion that functions as a hinge when the flexible section is bent, flexed, twisted or otherwise subjected to a motion related force. The hinge configuration improves durability and flexibility while minimizing ripping and cracking of the printed circuit board, particularly interconnects within the flexible section and a transition region between the flexible section and a rigid section of the printed circuit board. The hinge is configured to have a non-linear shape, such as a serpentine or circuitous path that can include curved portions, different linear portions or some combination of curved and linear portions.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: August 1, 2017
    Assignee: Multek Technologies, Ltd.
    Inventors: Joan K. Vrtis, Michael James Glickman, Mark Bergman, Shurui Shang
  • Patent number: 9659478
    Abstract: A stress and/or strain indicator comprises a wearable body, one or more flexible sections, one or more rigid sections and one or more strain gauges. The one or more strain gauges detect a level of stress and/or strain applied to the wearable body in order to indicate when the product is in danger of failing. A warning is activated based upon the level of stress and/or strain applied to the wearable body. For example, the stress and/or strain indicator is able to display a visual and/or an audible warning that a high level of stress and/or strain has been applied to the wearable body and the product is in danger of failing. In some embodiments, the stress and/or strain incident is recorded and downloadable. Consequently, a user is better informed as to when the electronic product is in danger of failing because of damage or misuse.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: May 23, 2017
    Assignee: Multek Technologies, Ltd.
    Inventors: Mark Bergman, Michael James Glickman
  • Patent number: 9661743
    Abstract: A flexible circuit board includes a center “rigid” section, such as a printed circuit stack, and an adjoining flexible multi-layer body that are fabricated from a common interconnect layer. A transition material is included at the interface between the center rigid section and the flexible multi-layer body to minimize ripping and cracking of the interconnect layer. The transition material can also be added at stress areas not related to the interface. The transition material is attached at the interface and stress areas of the flexible circuit board in order to strengthen the flexible circuit board in general and in particular the transition material included therein. The transition material layer is formed and deposited at one or more locations on or within the flexible circuit board in order to minimize, reduce, if not prevent cracking and ripping of the flexible circuit board as it is bent, flexed and/or twisted.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: May 23, 2017
    Assignee: Multek Technologies, Ltd.
    Inventors: Mark Bergman, Joan K. Vrtis
  • Patent number: D1017164
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: March 5, 2024
    Assignee: Bercom International, LLC
    Inventors: Jeff Given, Mark Bergman, Jeff Waffensmith, Matt Leyden
  • Patent number: D1017165
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: March 5, 2024
    Assignee: Bercom International, LLC
    Inventors: Jeff Given, Mark Bergman, Jeff Waffensmith, Matt Leyden
  • Patent number: D1082316
    Type: Grant
    Filed: January 9, 2024
    Date of Patent: July 8, 2025
    Assignee: Bercom International, LLC
    Inventors: Jeffrey Given, Mark Bergman, Jeffrey Waffensmith, Matthew Leyden
  • Patent number: D1083269
    Type: Grant
    Filed: January 9, 2024
    Date of Patent: July 8, 2025
    Assignee: Bercom International, LLC
    Inventors: Jeffrey Given, Mark Bergman, Jeffrey Waffensmith, Matthew Leyden
  • Patent number: D1104395
    Type: Grant
    Filed: June 30, 2023
    Date of Patent: December 2, 2025
    Assignee: Bercom International, LLC
    Inventors: Jeffrey Given, Jeffrey Waffensmith, Mark Bergman
  • Patent number: D1119150
    Type: Grant
    Filed: February 16, 2024
    Date of Patent: March 17, 2026
    Assignee: Bercom International, LLC
    Inventors: Jeffrey Waffensmith, Jeffrey Given, Mark Bergman