Abstract: A film-closure apparatus is provided which is suitable for closing plastic film material using heat. The apparatus comprises a guide path along which at least part of a plastics film material can pass; a drive means for moving the film material along the guide path; and a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface, and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface. The electrically conductive heating element is positionable on the guide path to apply heat to the film material thereon.

Abstract: A film-closure apparatus is provided which is suitable for closing plastic film material using heat. The apparatus comprises a guide path along which at least part of a plastics film material can pass; a drive means for moving the film material along the guide path; and a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface, and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface. The electrically conductive heating element is positionable on the guide path to apply heat to the film material thereon.