Abstract: A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 ?m. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof.

Abstract: An implantable medical leads has a conductor that includes one or more metal wires and one or more carbon nanotube wires extending in substantially the same direction as the one or more metal wires. Such conductors may result in less MRI-induced heating at electrodes of leads than conductors that do not contain carbon nanotubes.

Abstract: A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 ?m.

Abstract: A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 ?m. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof.

Abstract: An implantable medical leads has a conductor that includes one or more metal wires and one or more carbon nanotube wires extending in substantially the same direction as the one or more metal wires. Such conductors may result in less MRI-induced heating at electrodes of leads than conductors that do not contain carbon nanotubes.

Abstract: A lead frame for attaching leads to a hermetic feedthrough includes a cross-member and a plurality of leads. Each of the leads has an elongate body extending from the cross-member in a direction substantially parallel with one another, and each lead includes at least one of a notch on an end thereof opposite to the cross-member or a hole proximate to the end.

Abstract: A lead frame for attaching leads to a hermetic feedthrough includes a cross-member and a plurality of leads. Each of the leads has an elongate body extending from the cross-member in a direction substantially parallel with one another, and each lead includes at least one of a notch on an end thereof opposite to the cross-member or a hole proximate to the end.

Abstract: A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 ?m.

Abstract: A capacitor cell is presented. The capacitor cell includes an anode, a cathode spaced from and operatively associated with the anode, an electrolyte operatively associated with the anode and the cathode. A layered separator includes a plurality of separator material layers disposed between the anode and cathode. The plurality of separator material layers includes a first layer and a second layer. The first layer is characterized by a first value of a physical property and the second layer is characterized by a second value of the physical property.

Abstract: An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.

Abstract: A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.

Abstract: A sealed electrode enclosed in separator material is provided for use in a capacitor cell. The separator may either be adhered to the electrode in sheets, or may be formed into a pouch, which is used to enclose the electrode. A method of preparing the electrode sealed with separator is described in which an adhesive is used to secure the pouch to the electrode before sealing it. The prefabricated electrode and separator combination may be used in both coiled capacitor cells and flat capacitor cells that are often used in implantable medical devices. Electrodes prepared in this fashion can be efficiently and reliably aligned within the case of a capacitor cell, and have no exposed electrode surfaces that could lead to short-circuiting within the cell.

Abstract: Flat electrolytic capacitors, particularly, for use in implantable medical devices (IMDs), and the methods of fabrication of same are disclosed. The capacitors are formed with an electrode stack assembly comprising a plurality of stacked capacitor layers each comprising an anode sub-assembly of at least one anode layer, a cathode layer and separator layers wherein the anode and cathode layers have differing dimensions that avoid electrical short circuits between peripheral edges of adjacent anode and cathode layers but maximize anode electrode surface area.

Abstract: A sealed electrode enclosed in separator material is provided for use in a capacitor cell. The separator may either be adhered to the electrode in sheets, or may be formed into a pouch, which is used to enclose the electrode. A method of preparing the electrode sealed with separator is described in which an adhesive is used to secure the pouch to the electrode before sealing it. The prefabricated electrode and separator combination may be used in both coiled capacitor cells and flat capacitor cells that are often used in implantable medical devices. Electrodes prepared in this fashion can be efficiently and reliably aligned within the case of a capacitor cell, and have no exposed electrode surfaces that could lead to short-circuiting within the cell.