Abstract: A photovoltaic module with photovoltaic cell and a heat sink. The heat sink is attached on a side of the cell opposite to the light-receiving side of the photovoltaic cell. The heat sink can remove heat caused by light absorbed by the photovoltaic cell but not converted to electricity as well as heat generated by resistance to high current passing through electrodes of the photovoltaic cell. A photovoltaic module formed of such cells can exhibit greater energy conversion efficiency as a result of the ability to dissipate the heat. A method of making a solar module involves e.g. laminating a heat sink to a photovoltaic cell.

Abstract: Surgical devices such as implants or suture fastenings are assembled from a plurality of discrete components, one of which components includes a heat bondable plastic material for bonding the components together. At least two components are bonded to each other by the applying heat to the heat bondable plastic material of one component. The heat bondable plastic material is preferably a polymeric or composite material suitable for surgical applications and implantation in humans, and may be a biodegradable material. A laser may be used as the heat source. The present invention is advantageously embodied in heat bonded fastenings for sutures or K-wires, in which a variety of different suture anchors are usable, including expandable distal suture anchors.

Abstract: A multi-chip, module (MCM) having one or more high value chips such as ASICs, CPUs, DSPs or the like attached to the MCM substrate via a direct attach technology (such as flip chip) and one or more memory chips attached to the MCM substrate via a reworkable technology such as connector and receptacle-based package, wirebond package, chip scale package (CSP), leaded package, ball grid array package, or fine pitch ball grid array package. The MCM substrate may, in turn, be attached to a motherboard via solder balls (ball grid array); leads and/or connector interconnect technologies (such as compression sockets).