Abstract: Embodiments include methods, systems and computer program products for monitoring a person for a traumatic brain injury. Aspects include monitoring a gait of the user with one or more accelerometers embedded in the uniform and analyzing, by a processor, one or more characteristics of the gait of the user. Aspects also include determining whether the one or more characteristics of the gait indicate that the user may have suffered the traumatic brain injury and creating an alert that the user of the helmet may have suffered the traumatic brain injury.

Abstract: Embodiments include methods, systems and computer program products for monitoring a person for a traumatic brain injury. Aspects include monitoring a gait of the user with one or more accelerometers embedded in the uniform and analyzing, by a processor, one or more characteristics of the gait of the user. Aspects also include determining whether the one or more characteristics of the gait indicate that the user may have suffered the traumatic brain injury and creating an alert that the user of the helmet may have suffered the traumatic brain injury.

Abstract: Embodiments include methods, systems and computer program products for monitoring a user of a helmet for cumulative concussions. Aspects include monitoring one or more sensors in the helmet and receiving an output from the one or more sensors corresponding to an impact experienced by the helmet. Aspects also include calculating a cumulative concussion score based on the output of the one or more sensors and displaying an indication of the cumulative concussion score via an indicator on the helmet.

Abstract: Embodiments include methods, systems and computer program products for monitoring a user of a helmet for traumatic brain injury. Aspects include obtaining a saliva specimen from a mouthguard and providing the saliva specimen to a lab on chip. Aspects further include determining whether the saliva specimen contains a biomarker that indicates the user suffered a traumatic brain injury and creating an alert that the user of the helmet has suffered a traumatic brain injury.

Abstract: Embodiments include methods, systems and computer program products for monitoring a user of a helmet for traumatic brain injury. Aspects include obtaining a saliva specimen from a mouthguard and providing the saliva specimen to a lab on chip. Aspects further include determining whether the saliva specimen contains a biomarker that indicates the user suffered a traumatic brain injury and creating an alert that the user of the helmet has suffered a traumatic brain injury.

Abstract: Embodiments include methods, systems and computer program products for monitoring a user of a helmet for cumulative concussions. Aspects include monitoring one or more sensors in the helmet and receiving an output from the one or more sensors corresponding to an impact experienced by the helmet. Aspects also include calculating a cumulative concussion score based on the output of the one or more sensors and displaying an indication of the cumulative concussion score via an indicator on the helmet.

Abstract: Embodiments include method, systems and computer program products for automatic adjustment of helmet parameters based on a category of play. Aspects include monitoring a plurality of sensors in a helmet and determining the category of play for a user of the helmet based on data received from the plurality of sensors. Aspects further include automatically adjusting one or more parameters of the helmet based on the category of play.

Abstract: Embodiments include method, systems and computer program products for automatic adjustment of helmet parameters based on a category of play. Aspects include monitoring a plurality of sensors in a helmet and determining the category of play for a user of the helmet based on data received from the plurality of sensors. Aspects further include automatically adjusting one or more parameters of the helmet based on the category of play.

Abstract: Embodiments include method, systems and computer program products for monitoring a user for a traumatic brain injury. Aspects include monitoring a speech of the user with a microphone embedded in the helmet and analyzing, by a processor, one or more characteristics of the speech of the user. Aspects also include determining whether the one or more characteristics of the speech indicate that the user may have suffered the traumatic brain injury and creating an alert that the user of the helmet may have suffered the traumatic brain injury.

Abstract: Embodiments include method, systems and computer program products for monitoring a user for a traumatic brain injury. Aspects include monitoring a speech of the user with a microphone embedded in the helmet and analyzing, by a processor, one or more characteristics of the speech of the user. Aspects also include determining whether the one or more characteristics of the speech indicate that the user may have suffered the traumatic brain injury and creating an alert that the user of the helmet may have suffered the traumatic brain injury.

Abstract: Normally closed (shut) micro-electro-mechanical switches (MEMS), methods of manufacture and design structures are provided. A structure includes a beam structure that includes a first end hinged on a first electrode and in electrical contact with a second electrode, in its natural state when not actuated.

Abstract: Embodiments include methods, systems and computer program products for monitoring a user of a helmet for a traumatic brain injury. Aspects include monitoring one or more eyes of the user with a camera embedded in the helmet and analyzing, by a processor, one or more characteristics of the one or more eyes of the user. Aspects also include determining whether the one or more characteristics of the eyes indicate that the user may have suffered the traumatic brain injury and creating an alert that the user of the helmet may have suffered the traumatic brain injury.

Abstract: Embodiments include method, systems and computer program products for suggesting adjustments to an adjustable helmet based on analysis of play. Aspects include monitoring a plurality of sensors in the adjustable helmet and performing an analysis of play for a user of the adjustable helmet based on data received from the plurality of sensors. Aspects also include determining if an adjustment to the adjustable helmet should be made based on the analysis of play and creating an alert indicating that an adjustment to the helmet is needed.

Abstract: Embodiments include method, systems and computer program products for suggesting adjustments to an adjustable helmet based on analysis of play. Aspects include monitoring a plurality of sensors in the adjustable helmet and performing an analysis of play for a user of the adjustable helmet based on data received from the plurality of sensors. Aspects also include determining if an adjustment to the adjustable helmet should be made based on the analysis of play and creating an alert indicating that an adjustment to the helmet is needed.

Abstract: Detection circuits, methods of use and manufacture and design structures are provided herein. The structure includes at least one signal line traversing one or more metal layers of an integrated circuit. Circuitry is coupled to the at least one signal line, which is structured to receive a signal with a known signal from the at least one signal line or a signal from a different potential and, based on which signal is received, determine whether there is a structural defect in the integrated circuit.

Abstract: Normally closed (shut) micro-electro-mechanical switches (MEMS), methods of manufacture and design structures are provided. A structure includes a beam structure that includes a first end hinged on a first electrode and in electrical contact with a second electrode, in its natural state when not actuated.

Abstract: An integrated circuit wire structure. The structure includes a set of interconnect levels over a semiconductor substrate, each interconnect level of the set of interconnect levels comprising operational wires embedded in an interlevel dielectric layer; a dielectric barrier layer on an uppermost interconnect level of the set of interconnect levels and a bonding pad on the passivation layer; a stress reduction zone surrounding a perimeter of the bonding pad and extending into the set of interconnect levels; elongated fill wires in each of the interconnect levels in the stress reduction zone, the elongated fill wires not connected to any of the non-ground operational wires; and the elongated fill wires of each interconnect level of each set of interconnect levels physically connected to elongated fill wires of immediately upper and lower interconnect levels of the set of fill levels.

Abstract: Detection circuits, methods of use and manufacture and design structures are provided herein. The structure includes at least one signal line traversing one or more metal layers of an integrated circuit. Circuitry is coupled to the at least one signal line, which is structured to receive a signal with a known signal from the at least one signal line or a signal from a different potential and, based on which signal is received, determine whether there is a structural defect in the integrated circuit.

Abstract: Methods and structures are provided for packaging identically processed chips in a stacked structure. A latch chain includes a first latch chain, having a single or multiple latches, associated with a first chip. The first latch chain is structured to read data information from the first chip. The latch chain includes a second latch chain, having a single or multiple latches, associated with a second chip. The second latch chain is structured to read data information from the second chip. The first latch chain and the second latch chain are connected to one another such that form a single latch chain that crosses chip boundaries. The first latch chain and the second latch chain are structured to provide identification information for identifying the first chip and the second chip, respectively.

Abstract: An integrated circuit wire structure. The structure includes a set of interconnect levels over a semiconductor substrate, each interconnect level of the set of interconnect levels comprising operational wires embedded in an interlevel dielectric layer; a dielectric barrier layer on an uppermost interconnect level of the set of interconnect levels and a bonding pad on the passivation layer; a stress reduction zone surrounding a perimeter of the bonding pad and extending into the set of interconnect levels; elongated fill wires in each of the interconnect levels in the stress reduction zone, the elongated fill wires not connected to any of the non-ground operational wires; and the elongated fill wires of each interconnect level of each set of interconnect levels physically connected to elongated fill wires of immediately upper and lower interconnect levels of the set of fill levels.