Abstract: The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electronic components are encapsulated by a mold compound. In an exemplary aspect, a portion of the mold compound on the bottom side of the module substrate is removed, exposing a semiconductor die surface of at least one of the electronic components.

Abstract: The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electronic components are encapsulated by a mold compound. In an exemplary aspect, a portion of the mold compound on the bottom side of the module substrate is removed, exposing a semiconductor die surface of at least one of the electronic components.

Abstract: The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electronic components are encapsulated by a mold compound. In an exemplary aspect, a portion of the mold compound on the bottom side of the module substrate is removed, exposing a semiconductor die surface of at least one of the electronic components.

Abstract: The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electronic components are encapsulated by a mold compound. In an exemplary aspect, a portion of the mold compound on the bottom side of the module substrate is removed, exposing a semiconductor die surface of at least one of the electronic components.

Abstract: The multifunctional personal alert safety system of the present invention includes a portable safety monitoring device which is removably coupled for independent operation to an external self contained breathing apparatus (SCBA) containing a source of pressurized air. The portable safety monitoring device comprises a motion sensor unit, an alarm and a control having an activated position and a deactivated position. In addition the system includes a pressure switch which is responsive to the flow of pressurized air from said self contained breathing apparatus above a predetermined minimum level for causing the control to activate putting the motion sensor unit and alarm in an operational mode. Once in an operational mode the motion sensor and alarm remain operational independent of further operation of the pressure switch. A manual switch is also included for operating the portable monitoring safety device independent of the self contained breathing apparatus when the control is deactivated.

Abstract: An optical motion and angle sensor comprising a chamber, a light source for emitting light into a first half of the chamber along an axis of the chamber, and a plurality of light detectors for receiving light exiting from a second half of the chamber, at an angle relative to the axis of the chamber. When applied as a motion sensor, the sensor facilitates discrimination between various types of motion, and specifically allows the discrimination of slight normal motion from motion associated with incapacity of a person wearing the sensor. In addition, the sensor can provide this discrimination regardless of orientation. When applied as an angle sensor, the sensor facilitates the detection of the angle of inclination of the sensor relative to an axis, as well as the direction of the inclination.