Abstract: Embodiments of the disclosure include methods and systems for attaching an articulation section. In an embodiment, a medical instrument includes a first tubular member including a first end. The medical instrument also includes a second tubular member including a first end. The second tubular member includes a plurality of layers including an inner layer and a first layer including a fluorinated material. The inner layer includes a first section disposed under the first layer and a second section extending out from under the first layer. A portion of the first tubular member overlaps and is bonded to at least a portion of the second section of the inner layer of the second tubular member.

Abstract: Multichip module thermal management through backside metal systems and methods are disclosed. In one aspect, a multichip module includes one or more flip chip integrated circuits (ICs), each having a backside to which a metal heat conductor or spreader is attached. The presence of the metal heat conductor on the backside of the flip chip ICs allows for a better thermal path to remove heat from the ICs relative to the substrate. The improved thermal path reduces the likelihood of damage to the ICs or delamination of the module. A variety of methods are proposed to construct the backside metal systems. Additionally, a variety of capture features may be used to assist in structural integrity.

Abstract: The present disclosure relates to a substrate that includes a substrate body and a thermoelectric cooler embedded in the substrate body. The thermoelectric cooler includes a top-side plate with an element-contact pad and a bottom-side plate. The element-contact pad is on a top surface of the top-side plate, which faces a same direction as a top surface of the substrate body and is exposed to the external space of the substrate body. The bottom-side plate is below the top-side plate and close to a bottom surface of the top-side plate. Herein, the element-contact pad is configured to accommodate attachment of a heat-generating electrical element. The top-side plate is configured to change temperature of the heat-generating electrical element, and the bottom-side plate is configured to transfer heat to or absorb heat from the bottom surface of the substrate body.

Abstract: An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.

Abstract: An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.

Abstract: An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.

Abstract: The present disclosure relates to a substrate that includes a substrate body and a thermoelectric cooler embedded in the substrate body. The thermoelectric cooler includes a top-side plate with an element-contact pad and a bottom-side plate. The element-contact pad is on a top surface of the top-side plate, which faces a same direction as a top surface of the substrate body and is exposed to the external space of the substrate body. The bottom-side plate is below the top-side plate and close to a bottom surface of the top-side plate. Herein, the element-contact pad is configured to accommodate attachment of a heat-generating electrical element. The top-side plate is configured to change temperature of the heat-generating electrical element, and the bottom-side plate is configured to transfer heat to or absorb heat from the bottom surface of the substrate body.

Abstract: An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.

Abstract: In one embodiment, a thermoelectric device includes a plurality of thermoelectric elements arranged in a substantially polygonal pattern. The substantially polygonal pattern has more than four sides. The device includes a first dielectric plate coupled to the thermoelectric elements and a second dielectric plate coupled to the thermoelectric elements. The device also includes a first set of fins coupled to the first dielectric plate and a second set of fins coupled to the second dielectric plate.

Abstract: A temperature control device includes a thermoelectric device and a first sink. The thermoelectric device includes a plurality of thermoelectric elements electrically interconnected with one another by a plurality of electrical interconnects which are coupled between an interior surface of a first plate and an interior surface of a second plate. The first sink has a flat bottom and a plurality of generally parallel fins extending out of the flat bottom. Also, the flat bottom is coupled to an exterior surface of the first plate by a coupling media that includes a resilient and thermally-conductive pad.

Abstract: A temperature control device includes a thermoelectric device and a first sink. The thermoelectric device includes a plurality of thermoelectric elements electrically interconnected with one another by a plurality of electrical interconnects which are coupled between an interior surface of a first plate and an interior surface of a second plate. The first sink has a flat bottom and a plurality of generally parallel fins extending out of the flat bottom. Also, the flat bottom is coupled to an exterior surface of the first plate by a coupling media that includes a resilient and thermally-conductive pad.

Abstract: A well block for use with a Polymerase Chain Reaction (PCR) Cycler may include a body for holding a plurality of specimen vials, a base for attaching the well block to a temperature control device, and a temperature plate coupled to the base. Further, the temperature plate may include an anisotropic material for transferring thermal energy between the body and the temperature control device.

Abstract: An outdoor telecommunications cabinet comprising an electronic compartment adapted to contain heat-generating electrical equipment, having a main electronic compartment including a rear wall panel and two clamshell doors, a floor panel and a cover panel, including access areas and an equipment storage area, the main compartment being adapted to contain heat-generating electrical equipment, at least one rack inside said main electronic compartment for electronic equipment, a base assembly supporting the said electronic compartment, having a width and depth similar to said main electronic compartment capable of being anchored to a base plate or pad, a ventilated sub-compartment in the base assembly containing an environmental cooling system, a pair of clamshell doors, movable between an open position permitting access to both front and back sides of said electrical equipment and a closed position in which the doors maintain a substantially closed environment in the electronic compartment, a cable entry port, ty

Abstract: An outdoor telecommunications cabinet comprising an electronic compartment adapted to contain heat-generating electrical equipment, having a main electronic compartment including a rear wall panel and two clamshell doors, a floor panel and a cover panel, including access areas and an equipment storage area, the main compartment being adapted to contain heat-generating electrical equipment, at least one rack inside said main electronic compartment for electronic equipment, a base assembly supporting the said electronic compartment, having a width and depth similar to said main electronic compartment capable of being anchored to a base plate or pad, a ventilated sub-compartment in the base assembly containing an environmental cooling system, a pair of clamshell doors, movable between an open position permitting access to both front and back sides of said electrical equipment and a closed position in which the doors maintain a substantially closed environment in the electronic compartment, a cable entry port, ty

Abstract: An electrical equipment cabinet is provided that includes an enclosure adapted to contain electrical equipment. A battery compartment, which is located in the enclosure, is adapted to contain at least one battery electrically coupled to the electrical equipment. The battery compartment has first and second opposing side walls, a bottom surface, and a first pair of vents located in the first and second side walls through which external air flows to remove heat. In addition, a second pair of vents, which are also located in the first and second side walls, allow gas emitted by the battery to escape by diffusion. A thermal stabilizing unit is disposed in the battery compartment for regulating the temperature of the battery in contact therewith. The thermal stabilizing unit has a conduit therein for conducting the external air flow between the vents in the first pair of vents.