Patents by Inventor Mark Cairnie

Mark Cairnie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealed interface power module housing
    Patent number: 11956914
    Abstract: A number of different sealed interfaces for power modules are described. In one example, a sealed interface includes a printed circuit board including a contact pad for power conduction to a bus bar of the printed circuit board, a semiconductor module including at least one power transistor, a terminal pin electrically coupled to the power module, and a housing for the power module. The housing includes an open terminal aperture that extends through the housing. The printed circuit board is seated upon the open terminal aperture, to close and seal the open terminal aperture, with the contact pad positioned within the open terminal aperture. The terminal pin contacts the contact pad of the printed circuit board within the open terminal aperture, and the open terminal aperture comprises a transitional feature to abate electric field intensity around an interface between the open terminal aperture and the printed circuit board.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: April 9, 2024
    Assignees: VIRGINIA TECH INTELLECTUAL PROPERTIES, INC., UNIVERSITY OF NOTTINGHAM
    Inventors: Christina DiMarino, Mark Cairnie, Dushan Boroyevich, Rolando Burgos, C. Mark Johnson
  • SEALED INTERFACE POWER MODULE HOUSING
    Publication number: 20230053718
    Abstract: A number of different sealed interfaces for power modules are described. In one example, a sealed interface includes a printed circuit board including a contact pad for power conduction to a bus bar of the printed circuit board, a semiconductor module including at least one power transistor, a terminal pin electrically coupled to the power module, and a housing for the power module. The housing includes an open terminal aperture that extends through the housing. The printed circuit board is seated upon the open terminal aperture, to close and seal the open terminal aperture, with the contact pad positioned within the open terminal aperture. The terminal pin contacts the contact pad of the printed circuit board within the open terminal aperture, and the open terminal aperture comprises a transitional feature to abate electric field intensity around an interface between the open terminal aperture and the printed circuit board.
    Type: Application
    Filed: August 18, 2021
    Publication date: February 23, 2023
    Inventors: Christina DiMarino, Mark Cairnie, Dushan Boroyevich, Rolando Burgos, C. Mark Johnson