Abstract: A dielectric glass composition suitable for use in an electronic device which comprises a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment, and one or more alkali metal oxides, wherein (i) the total content of the alkali metal oxides is at least about 10 wt % and no more than about 35 wt %, based upon 100% total weight of the glass composition, (ii) the median particle size (d50) of the glass composition is no more than about 5 ?m, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.

Abstract: The invention provides an electroconductive paste comprising metallic particles and an organic vehicle comprising an aldehyde resin and a solvent. The invention also provides an electroconductive paste comprising metallic particles comprising at least two types of metallic particles selected from the group consisting of a first metallic particle having an average particle size d50 of at least about 1 ?m and no more than about 4 ?m, a second metallic particle having a d50 of at least about 8 ?m and no more than about 11.5 ?m, and a third metallic particle having d50 of at least about 5 ?m and no more than about 8 ?m, and an organic vehicle. The invention further provides an article comprising a glass substrate comprising a transparent conductive oxide coating and a conductive electrode formed by applying aforementioned conductive paste on said glass substrate, and a method of producing such an article.

Abstract: A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

Abstract: An electroconductive hole plug paste comprising about 60-80 wt % of platinum particles, about 10-20 wt % of Al2O3, and about 10-20 wt % of organic vehicle, based upon 100% total weight of the paste, wherein the organic vehicle includes at least one viscosity-modifying component in an amount sufficient to provide the electroconductive hole plug paste with a viscosity of about 800-1,500 kcPs, is provided. A ceramic substrate assembly for an implantable medical device having the electroconductive hole plug paste of the invention, and a method of forming the same, are also provided.

Abstract: The invention provides an electroconductive paste comprising 50-90 wt. % of copper particle, 0.5-10 wt. % of a glass frit, 0.1-5% wt. % of adhesion promoter, which is at least one selected member from the group consisting of cuprous oxide, titanium oxide, zirconium oxide, boron resinate, zirconium resinate, amorphous boron, lithium phosphate, bismuth oxide, aluminum oxide, and zinc oxide, and 5-20 wt. % of an organic vehicle. An article comprising an aluminum nitride substrate and electroconductive paste of the invention is also provided. A method of forming an electroconductive circuit comprising is also provided.

Abstract: A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

Abstract: A dielectric glass composition suitable for use in an electronic device which comprises a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment, and one or more alkali metal oxides, wherein (i) the total content of the alkali metal oxides is at least about 10 wt % and no more than about 35 wt %, based upon 100% total weight of the glass composition, (ii) the median particle size (d50) of the glass composition is no more than about 5 ?m, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.

Abstract: An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m2/g, second copper particles having a specific surface area of about 0.5-2.5 m2/g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zinc-barium oxide glass frit, and an organic vehicle.

Abstract: An electroconductive hole plug paste comprising about 60-80 wt % of platinum particles, about 10-20 wt % of Al2O3, and about 10-20 wt % of organic vehicle, based upon 100% total weight of the paste, wherein the organic vehicle includes at least one viscosity-modifying component in an amount sufficient to provide the electroconductive hole plug paste with a viscosity of about 800-1,500 kcPs, is provided. A ceramic substrate assembly for an implantable medical device having the electroconductive hole plug paste of the invention, and a method of forming the same, are also provided.

Abstract: The invention provides an electroconductive paste comprising 50-90 wt. % of copper particle, 0.5-10 wt. % of a glass frit, 0.1-5% wt. % of adhesion promoter, which is at least one selected member from the group consisting of cuprous oxide, titanium oxide, zirconium oxide, boron resinate, zirconium resinate, amorphous boron, lithium phosphate, bismuth oxide, aluminum oxide, and zinc oxide, and 5-20 wt. % of an organic vehicle. An article comprising an aluminum nitride substrate and electroconductive paste of the invention is also provided. A method of forming an electroconductive circuit comprising is also provided.

Abstract: A sealing glass composition including about 30-95 wt % glass or ceramic particles, and about 1-50 wt % organic vehicle, wherein the organic vehicle comprises an acrylic resin component and a solvent, based upon 100% total weight of the sealing glass composition, wherein the composition has a viscosity of at least about 200 kcPs and no more than about 1450 kcPs, is provided. A method of applying a sealing glass composition to a substrate comprising the steps of providing a metal substrate, providing a supporting sheet having a front surface coated with a releasing agent, depositing a sealing glass composition onto the front surface of the releasable sheet, drying the sealing glass composition to form a sealing glass composition decal, removing the sealing glass composition decal from the front surface of the supporting sheet, and placing the dried sealing glass composition decal onto a metal substrate, is provided.

Abstract: The invention provides an electroconductive paste comprising metallic particles and an organic vehicle comprising an aldehyde resin and a solvent. The invention also provides an electroconductive paste comprising metallic particles comprising at least two types of metallic particles selected from the group consisting of a first metallic particle having an average particle size d50 of at least about 1 ?m and no more than about 4 ?m, a second metallic particle having a d50 of at least about 8 ?m and no more than about 11.5 ?m, and a third metallic particle having d50 of at least about 5 ?m and no more than about 8 ?m, and an organic vehicle. The invention further provides an article comprising a glass substrate comprising a transparent conductive oxide coating and a conductive electrode formed by applying aforementioned conductive paste on said glass substrate, and a method of producing such an article.

Abstract: An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m2/g, second copper particles having a specific surface area of about 0.5-2.5 m2/g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zinc-barium oxide glass frit, and an organic vehicle.