Patents by Inventor Mark Chou
Mark Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210068350Abstract: The present invention is directed to a small hand-held garden tool, for example a hedgetrimmer, having an electrically powered powerhead, and a detachable pole assembly. The powerhead can be used alone to cut nearby vegetation or in combination with a pole assembly to reach vegetation farther away. The powerhead has a separate handle and motor chamber, with the pole assembly being secured to the motor chamber. Actuation of the powerhead is controlled by a trigger on the handle. However, when connected to the pole assembly, actuation of the powerhead is controlled by a second trigger on the pole assembly.Type: ApplicationFiled: August 28, 2019Publication date: March 11, 2021Inventors: Mark CHOU, Bojun SHI, Kejia WANG, Xiubao LAN
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Patent number: 10537983Abstract: According to examples, a modular power tool may include a motor housing including an electric motor, a drive member connected to the electric motor, the drive member being connected to a drive coupler, an extension pole including an input shaft having a first end connector and a second end connector, in which the first end connector is configured to mate with the drive coupler, and an attachment component having an attachment connector and a working implement, in which the attachment component is configured to mate with either of the drive coupler and the second end connector.Type: GrantFiled: June 27, 2017Date of Patent: January 21, 2020Assignee: Black & Decker, Inc.Inventors: Kelly E. Dyer, Elyse Edwards, Mark Chou, Anthony Reth, Erik Cussins, David A. Miller, Drake L. Fisher
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Patent number: 10420287Abstract: The present invention is directed to a small hand-held garden tool, for example a hedgetrimmer, having an electrically powered powerhead, and a detachable pole assembly. The powerhead can be used alone to cut nearby vegetation or in combination with a pole assembly to reach vegetation farther away. The powerhead has a separate handle and motor chamber, with the pole assembly being secured to the motor chamber. Actuation of the powerhead is controlled by a trigger on the handle. However, when connected to the pole assembly, actuation of the powerhead is controlled by a second trigger on the pole assembly.Type: GrantFiled: March 3, 2016Date of Patent: September 24, 2019Assignee: Black & Decker, Inc.Inventors: Mark Chou, Bojun Shi, Kejia Wang, Xiubao Lan
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Publication number: 20180104809Abstract: According to examples, a modular power tool may include a motor housing including an electric motor, a drive member connected to the electric motor, the drive member being connected to a drive coupler, an extension pole including an input shaft having a first end connector and a second end connector, in which the first end connector is configured to mate with the drive coupler, and an attachment component having an attachment connector and a working implement, in which the attachment component is configured to mate with either of the drive coupler and the second end connector.Type: ApplicationFiled: June 27, 2017Publication date: April 19, 2018Applicant: BLACK & DECKER INC.Inventors: Kelly E. Dyer, Elyse Edwards, Mark Chou, Anthony Reth, Erik Cussins, David A. Miller, Drake L. Fisher
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Publication number: 20170251608Abstract: The present invention is directed to a small hand-held garden tool, for example a hedgetrimmer, having an electrically powered powerhead, and a detachable pole assembly. The powerhead can be used alone to cut nearby vegetation or in combination with a pole assembly to reach vegetation farther away. The powerhead has a separate handle and motor chamber, with the pole assembly being secured to the motor chamber. Actuation of the powerhead is controlled by a trigger on the handle. However, when connected to the pole assembly, actuation of the powerhead is controlled by a second trigger on the pole assembly.Type: ApplicationFiled: March 3, 2016Publication date: September 7, 2017Inventors: Mark CHOU, Bojun SHI, Kejia WANG, Xiubao LAN
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Patent number: 8529136Abstract: A ball bearing having external surfaces coated with ceramic materials is provided. The raceways of the ball bearing may advantageously be formed of metal such as stainless steel. The ceramic coating acts as an insulator increasing the resistance of the ball bearing to heat within the ball bearing environment. The balls within the raceway of the ball bearing may advantageously be coated with a lubricant to decrease friction in the ball bearing because the insulating ceramic coating prevents the environmental heat from causing the degradation of the lubricant.Type: GrantFiled: March 30, 2009Date of Patent: September 10, 2013Assignee: Wafertech, LLCInventors: Xiao-Jun Liu, Mark Chou
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Patent number: 8187965Abstract: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.Type: GrantFiled: May 31, 2007Date of Patent: May 29, 2012Assignee: Megica CorporationInventors: Mou-Shiung Lin, Michael Chen, Chien-Kang Chou, Mark Chou
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Publication number: 20100247280Abstract: A ball bearing having external surfaces coated with ceramic materials is provided. The raceways of the ball bearing may advantageously be formed of metal such as stainless steel. The ceramic coating acts as an insulator increasing the resistance of the ball bearing to heat within the ball bearing environment. The balls within the raceway of the ball bearing may advantageously be coated with a lubricant to decrease friction in the ball bearing because the insulating ceramic coating prevents the environmental heat from causing the degradation of the lubricant.Type: ApplicationFiled: March 30, 2009Publication date: September 30, 2010Inventors: Xiao-Jun Liu, Mark Chou
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Patent number: 7554208Abstract: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.Type: GrantFiled: May 31, 2007Date of Patent: June 30, 2009Assignee: Megica Corp.Inventors: Mark Chou, Michael Chen, Mou-Shiung Lin, Chien-Kang Chou
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Publication number: 20090053887Abstract: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.Type: ApplicationFiled: May 31, 2007Publication date: February 26, 2009Applicant: MEGICA CORPORATIONInventors: Mou-Shiung Lin, Michael Chen, Chien-Kang Chou, Mark Chou
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Patent number: 7470997Abstract: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.Type: GrantFiled: March 9, 2004Date of Patent: December 30, 2008Assignee: Megica CorporationInventors: Mou-Shiung Lin, Michael Chen, Chien Kang Chou, Mark Chou
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Publication number: 20070252281Abstract: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.Type: ApplicationFiled: May 31, 2007Publication date: November 1, 2007Applicant: MEGICA CORPORATIONInventors: Mou-Shiung Lin, Michael Chen, Chien Chou, Mark Chou
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Publication number: 20050017361Abstract: In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.Type: ApplicationFiled: March 9, 2004Publication date: January 27, 2005Inventors: Mou-Shiung Lin, Michael Chen, Chien Chou, Mark Chou
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Patent number: 6840677Abstract: A ceramic bearing structure is constructed to include an axle bush having an axially extended axle hole, and an axle pivoted to the axle hole of the axle bush, the axle bush having a radial open chamber extended across the axle hole. The radial open chamber diminishes the material of the axle bush, reduces the contact area between the axle and the axle bush, and provides a spacious lubrication grease accumulation chamber.Type: GrantFiled: April 29, 2003Date of Patent: January 11, 2005Assignee: ACT-RX Technology CorporationInventors: Weim Chen, Oscar Lee, San Lin, Mark Chou
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Publication number: 20040008915Abstract: A ceramic bearing structure is constructed to include an axle bush having an axially extended axle hole, and an axle pivoted to the axle hole of the axle bush, the axle bush having a radial open chamber extended across the axle hole. The radial open chamber diminishes the material of the axle bush, reduces the contact area between the axle and the axle bush, and provides a spacious lubrication grease accumulation chamber.Type: ApplicationFiled: April 29, 2003Publication date: January 15, 2004Applicant: ACT-RX TECHNOLOGY CORPORATIONInventors: Weim Chen, Oscar Lee, San Lin, Mark Chou