Patents by Inventor Mark Crooks

Mark Crooks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aggregate processing systems, methods and apparatus
    Patent number: 12544767
    Abstract: Aggregate processing systems, methods, and apparatus are described. In some embodiments, a plant is configurable in one of a plurality of configurations.
    Type: Grant
    Filed: May 6, 2024
    Date of Patent: February 10, 2026
    Assignee: Superior Industries, Inc.
    Inventors: Doug Lambert, Mark Crooks, Lafe Grimm, Matthew Gordon
  • AGGREGATE PROCESSING SYSTEMS, METHODS AND APPARATUS
    Publication number: 20240286144
    Abstract: Aggregate processing systems, methods, and apparatus are described. In some embodiments, a plant is configurable in one of a plurality of configurations.
    Type: Application
    Filed: May 6, 2024
    Publication date: August 29, 2024
    Inventors: Doug Lambert, Mark Crooks, Lafe Grimm, Matthew Gordon
  • Aggregate processing systems, methods and apparatus
    Patent number: 11980896
    Abstract: Aggregate processing systems, methods, and apparatus are described. In some embodiments, a plant is configurable in one of a plurality of configurations.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: May 14, 2024
    Assignee: Superior Industries, Inc.
    Inventors: Doug Lambert, Mark Crooks, Lafe Grimm, Matthew Gordon
  • Aggregate processing systems, methods and apparatus
    Patent number: 11786937
    Abstract: Aggregate processing systems, methods, and apparatus are described. In some embodiments, a plant is configurable in one of a plurality of configurations, e.g. by sliding one of a plurality of chutes, hoppers, or flumes into a frame and/or by modifying a height of the frame. In some embodiments, a roller floor assembly is in a maintenance configuration when a chute is in a maintenance position. In some embodiments, a flume includes one or more diverters for moving a subset of material from one side of the flume to another.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: October 17, 2023
    Assignee: Superior Industries, Inc.
    Inventors: Doug Lambert, Mark Crooks, Lafe Grimm, Matt Gordon
  • AGGREGATE PROCESSING APPARATUS, SYSTEMS, AND METHODS
    Publication number: 20230271192
    Abstract: Aggregate processing systems, methods and apparatus are described. Some embodiments include a plurality of equipment criteria sensors, product quantity sensors, product characteristic sensors, and/or actuators. Some embodiments include a control system incorporating algorithm logic. Some embodiments include a control system incorporating artificial intelligence logic.
    Type: Application
    Filed: May 4, 2023
    Publication date: August 31, 2023
    Inventors: Danilo Bibancos, John Rodriguez, Lafe Grimm, Matthew Gordon, Mark Crooks, Troy Plattner
  • AGGREGATE PROCESSING SYSTEMS, METHODS AND APPARATUS
    Publication number: 20220288603
    Abstract: Aggregate processing systems, methods, and apparatus are described. In some embodiments, a plant is configurable in one of a plurality of configurations.
    Type: Application
    Filed: March 9, 2022
    Publication date: September 15, 2022
    Inventors: Doug Lambert, Mark Crooks, Lafe Grimm, Matthew Gordon
  • Methods for processing semiconductor wafers having a polycrystalline finish
    Patent number: 11355346
    Abstract: A method of processing a semiconductor wafer includes depositing a silicon layer on the semiconductor wafer. The silicon layer has a substantially uniform thickness. The silicon layer is polished to smooth the silicon layer such that the thickness is substantially uniform after polishing.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: June 7, 2022
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Guoqiang David Zhang, Mark Crooks, Tracy Michelle Ragan
  • AGGREGATE PROCESSING SYSTEMS, METHODS AND APPARATUS
    Publication number: 20210197230
    Abstract: Aggregate processing systems, methods, and apparatus are described. In some embodiments, a plant is configurable in one of a plurality of configurations, e.g. by sliding one of a plurality of chutes, hoppers, or flumes into a frame and/or by modifying a height of the frame. In some embodiments, a roller floor assembly is in a maintenance configuration when a chute is in a maintenance position. In some embodiments, a flume includes one or more diverters for moving a subset of material from one side of the flume to another.
    Type: Application
    Filed: August 28, 2019
    Publication date: July 1, 2021
    Inventors: Doug Lambert, Mark Crooks, Lafe Grimm, Matt Gordon
  • METHODS FOR PROCESSING SEMICONDUCTOR WAFERS HAVING A POLYCRYSTALLINE FINISH
    Publication number: 20200312671
    Abstract: A method of processing a semiconductor wafer includes depositing a silicon layer on the semiconductor wafer. The silicon layer has a substantially uniform thickness. The silicon layer is polished to smooth the silicon layer such that the thickness is substantially uniform after polishing.
    Type: Application
    Filed: June 15, 2020
    Publication date: October 1, 2020
    Inventors: Guoqiang David Zhang, Mark Crooks, Tracy Michelle Ragan
  • Methods for processing semiconductor wafers having a polycrystalline finish
    Patent number: 10699908
    Abstract: A method of processing a semiconductor wafer includes depositing a silicon layer on the semiconductor wafer. The silicon layer has a substantially uniform thickness. The silicon layer is polished to smooth the silicon layer such that the thickness is substantially uniform after polishing.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: June 30, 2020
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Guoqiang David Zhang, Mark Crooks, Tracy Michelle Ragan
  • METHODS FOR PROCESSING SEMICONDUCTOR WAFERS HAVING A POLYCRYSTALLINE FINISH
    Publication number: 20180151384
    Abstract: A method of processing a semiconductor wafer includes depositing a silicon layer on the semiconductor wafer. The silicon layer has a substantially uniform thickness. The silicon layer is polished to smooth the silicon layer such that the thickness is substantially uniform after polishing.
    Type: Application
    Filed: May 26, 2016
    Publication date: May 31, 2018
    Inventors: Guoqiang David Zhang, Mark Crooks, Tracy Michelle Ragan