Patents by Inventor Mark CYFFKA

Mark CYFFKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUSPENSION FOR CHEMICAL MECHANICAL PLANARIZATION (CMP) AND METHOD EMPLOYING THE SAME
    Publication number: 20220315802
    Abstract: The present disclosure relates to aqueous suspensions suitable for chemical mechanical planarization (CMP), the use of aqueous suspensions and a method of CMP using aqueous suspensions. The suspensions and method can be used for CMP of silicon carbide surfaces.
    Type: Application
    Filed: March 30, 2022
    Publication date: October 6, 2022
    Inventors: Sridevi R. ALETY, Mark CYFFKA, Niraj MAHADEV
  • SUSPENSION FOR CHEMICAL MECHANICAL PLANARIZATION (CMP) AND METHOD EMPLOYING THE SAME
    Publication number: 20220306902
    Abstract: The present disclosure relates to aqueous suspensions suitable for chemical mechanical planarization (CMP), the use of aqueous suspensions and a method of CMP using aqueous suspensions. The suspensions and method can be used for CMP of silicon carbide surfaces.
    Type: Application
    Filed: March 24, 2022
    Publication date: September 29, 2022
    Inventors: Sridevi R. ALETY, Mark CYFFKA, Niraj MAHADEV