Patents by Inventor Mark D. Barnell

Mark D. Barnell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10915152
    Abstract: Methods and systems for scalable high-performance embedded computing architectures. According to an embodiment, a scalable high-performance embedded computing system increases computational capability within the restrictive size, weight, and power constraints of systems such as the external pod payloads of unmanned aircraft systems, among many other possible systems. The core computer capability can be placed in various environments, and according to one embodiment utilizes a flight-certified aeronautics pod that is scalable in length. The scalable HPEC system can be connected to external data sources, or the nose and tail can be made of Radio Frequency transparent material, enabling the use of various RF sensing technologies within the same aeronautics enclosure. According to an embodiment, a lightweight, thermally-efficient conduction cooled chassis supports the required board and interface hardware.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: February 9, 2021
    Assignee: SRC, Inc.
    Inventors: Darrek J. Isereau, Christopher T. Capraro, Mark D. Barnell
  • Publication number: 20180018004
    Abstract: Methods and systems for scalable high-performance embedded computing architectures. According to an embodiment, a scalable high-performance embedded computing system increases computational capability within the restrictive size, weight, and power constraints of systems such as the external pod payloads of unmanned aircraft systems, among many other possible systems. The core computer capability can be placed in various environments, and according to one embodiment utilizes a flight-certified aeronautics pod that is scalable in length. The scalable HPEC system can be connected to external data sources, or the nose and tail can be made of Radio Frequency transparent material, enabling the use of various RF sensing technologies within the same aeronautics enclosure. According to an embodiment, a lightweight, thermally-efficient conduction cooled chassis supports the required board and interface hardware.
    Type: Application
    Filed: April 26, 2017
    Publication date: January 18, 2018
    Applicant: SRC, Inc.
    Inventors: Darrek J. Isereau, Christopher T. Capraro, Mark D. Barnell